Kondo; Eiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kondo; Eiichi.The latest application filed is for "deposition method for oxide thin film or stacked metal thin films using supercritical fluid or subcritical fluid, and deposition apparatus therefor".

Company Profile

0.6.2

Kondo; Eiichi - Yamanashi JP
Kondo; Eiichi - Tokyo JP
Kondo; Eiichi - Kawasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Deposition method for oxide thin film or stacked metal thin films using supercritical fluid or subcritical fluid, and deposition apparatus therefor Grant 7,695,760 - Kondo April 13, 2	2010-04-13
IP multicast distribution system, streaming data distribution system and program therefor Grant 7,561,570 - Kondo July 14, 2	2009-07-14
Deposition Method For Oxide Thin Film Or Stacked Metal Thin Films Using Supercritical Fluid Or Subcritical Fluid, And Deposition Apparatus Therefor App 20080107804 - Kondo; Eiichi	2008-05-08
IP multicast distribution system, streaming data distribution system and program therefor App 20050002395 - Kondo, Eiichi	2005-01-06
Color image formation apparatus Grant 4,165,165 - Iwami , et al. August 21, 1	1979-08-21
Color electrophotographic method and apparatus Grant 4,106,870 - Kondo , et al. August 15, 1	1978-08-15
Heat-fixing device Grant 4,080,158 - Kondo , et al. March 21, 1	1978-03-21
Color reproduction device Grant 3,910,232 - Kondo , et al. October 7, 1	1975-10-07

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