Konarski; Mark M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Konarski; Mark M..The latest application filed is for "curable compositions".

Company Profile

3.20.11

Konarski; Mark M. - Old Saybrook CT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Curable compositions Grant 10,995,210 - Konarski , et al. May 4, 2	2021-05-04
Primer compositions for injection molding Grant 10,815,388 - Konarski , et al. October 27, 2	2020-10-27
Curable Compositions App 20200095418 - Konarski; Mark M. ; et al.	2020-03-26
Primer Compositions for Injection Molding App 20160075902 - Konarski; Mark M. ; et al.	2016-03-17
Photolytically induced redox curable compositions Grant 9,080,084 - Konarski July 14, 2	2015-07-14
Photolytically Induced Redox Curable Compositions App 20140124134 - Konarski; Mark M.	2014-05-08
Visible light curing systems, methods for reducing health risks to individuals exposed to systems designed to cure curable compositions by exposure to radiation, methods for bonding substrates and visible light curing compositions Grant 7,915,319 - Konarski , et al. March 29, 2	2011-03-29
UV curable compositions Grant 7,547,735 - Konarski , et al. June 16, 2	2009-06-16
Photoinitiated Cationic Epoxy Compositions App 20070267134 - Konarski; Mark M. ; et al.	2007-11-22
Visible light curing systems, methods for reducing health risks to individuals exposed to systems designed to cure curable compositions by exposure to radiation, methods for bonding substrates and visible light curing compositions App 20070138411 - Konarski; Mark M. ; et al.	2007-06-21
Epoxy-extended polyacrylate toughening agent Grant 7,193,016 - Woods , et al. March 20, 2	2007-03-20
Reworkable compositions incorporating episulfide resins Grant 7,108,920 - Crane , et al. September 19, 2	2006-09-19
Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith Grant 7,109,061 - Crane , et al. September 19, 2	2006-09-19
Polysulfide-based toughening agents, compositions containing same and methods for the use thereof Grant 7,087,304 - Woods , et al. August 8, 2	2006-08-08
Fluxing underfill compositions Grant 7,009,009 - Crane , et al. March 7, 2	2006-03-07
Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex Grant 6,951,907 - Konarski October 4, 2	2005-10-04
Thermosetting resin compositions useful as underfill sealants Grant 6,893,736 - Konarski May 17, 2	2005-05-17
Underfill sealant of epoxy resins, adhesion promotor and curative of N-containing compound and transition metal complex Grant 6,818,318 - Konarski November 16, 2	2004-11-16
Fluxing underfill compositions Grant 6,706,417 - Konarski , et al. March 16, 2	2004-03-16
Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes Grant 6,670,430 - Konarski December 30, 2	2003-12-30
Method of bonding die chip with underfill fluxing composition Grant 6,667,194 - Crane , et al. December 23, 2	2003-12-23
Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners Grant 6,632,893 - Konarski , et al. October 14, 2	2003-10-14
Thermosetting resin compositions comprising epoxy resins, adhesion promoters and curatives based on the combination of nitrogen compounds and transition metal complexes App 20030190479 - Konarski, Mark M.	2003-10-09
Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners Grant 6,617,399 - Konarski September 9, 2	2003-09-09
Thermosetting resin compositions useful as underfill sealants App 20030131937 - Konarski, Mark M.	2003-07-17
Fluxing underfill compositions App 20030124378 - Konarski, Mark M. ; et al.	2003-07-03
Shipping container for exothermic material Grant 6,519,968 - Konarski February 18, 2	2003-02-18
Fluxing underfill compositions Grant 6,458,472 - Konarski , et al. October 1, 2	2002-10-01
Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith App 20020089067 - Crane, Lawrence N. ; et al.	2002-07-11
Toughened thermosetting resin compositions useful as underfill sealants App 20020058778 - Konarski, Mark M. ; et al.	2002-05-16
Underfill sealants with improved adhesion, improved resistance to moisture absorption and improved resistance to stress cracking App 20020058756 - Konarski, Mark M.	2002-05-16

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