Komuta; Naoyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Komuta; Naoyuki.The latest application filed is for "semiconductor device manufacturing method".

Company Profile

5.17.17

Komuta; Naoyuki - Kawasaki Kanagawa JP
Komuta; Naoyuki - Kanagawa JP
Komuta; Naoyuki - Oita Oita JP
Komuta; Naoyuki - Oita JP
Komuta; Naoyuki - Oita-shi JP
Komuta; Naoyuki - Kawasaki JP
Komuta; Naoyuki - Kawasaki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device manufacturing method Grant 10,903,200 - Karakane , et al. January 26, 2	2021-01-26
Semiconductor device and manufacturing method thereof Grant 10,854,576 - Karakane , et al. December 1, 2	2020-12-01
Semiconductor Device Manufacturing Method App 20200185373 - KARAKANE; Yuji ; et al.	2020-06-11
Semiconductor device manufacturing method Grant 10,600,773 - Karakane , et al.	2020-03-24
Method and apparatus for manufacturing a semiconductor device including a plurality of semiconductor chips connected with bumps Grant 10,217,676 - Fukayama , et al. Feb	2019-02-26
Apparatus and method for manufacturing semiconductor device Grant 10,090,273 - Komuta October 2, 2	2018-10-02
Semiconductor Device And Manufacturing Method Thereof App 20180261574 - KARAKANE; Yuji ; et al.	2018-09-13
Method for manufacturing electronic component and manufacturing apparatus of electronic component Grant 9,960,143 - Homma , et al. May 1, 2	2018-05-01
Semiconductor Device Manufacturing Method App 20180076187 - KARAKANE; Yuji ; et al.	2018-03-15
Method For Manufacturing Electronic Component And Manufacturing Apparatus Of Electronic Component App 20170263585 - HOMMA; Soichi ; et al.	2017-09-14
Method And Apparatus For Manufacturing A Semiconductor Device Including A Plurality Of Semiconductor Chips Connected With Bumps App 20170069551 - FUKAYAMA; Shinya ; et al.	2017-03-09
Method for manufacturing semiconductor device and semiconductor device Grant 9,449,949 - Komuta September 20, 2	2016-09-20
Apparatus And Method For Manufacturing Semiconductor Device App 20160079200 - KOMUTA; Naoyuki	2016-03-17
Semiconductor device and manufacturing method thereof Grant 9,224,713 - Tsukiyama , et al. December 29, 2	2015-12-29
Method For Manufacturing Semiconductor Device And Semiconductor Device App 20150262847 - KOMUTA; Naoyuki	2015-09-17
Stacked Electronic Component And Manufacturing Method Thereof App 20150214193 - Yoshimura; Atsushi ; et al.	2015-07-30
Inspection apparatus and inspection method for semiconductor device Grant 9,052,187 - Komuta , et al. June 9, 2	2015-06-09
Stacked electronic component and manufacturing method thereof Grant 9,024,424 - Yoshimura , et al. May 5, 2	2015-05-05
Semiconductor Device And Manufacturing Method Thereof App 20140206144 - TSUKIYAMA; Satoshi ; et al.	2014-07-24
Semiconductor device and manufacturing method thereof Grant 8,710,654 - Tsukiyama , et al. April 29, 2	2014-04-29
Inspection Apparatus And Inspection Method For Semiconductor Device App 20130250298 - KOMUTA; Naoyuki ; et al.	2013-09-26
Semiconductor Device And Manufacturing Method Thereof App 20130134583 - TSUKIYAMA; Satoshi ; et al.	2013-05-30
Stacked Electronic Component And Manufacturing Method Thereof App 20120306103 - Yoshimura; Atsushi ; et al.	2012-12-06
Stacked electronic component and manufacturing method thereof Grant 8,268,673 - Yoshimura , et al. September 18, 2	2012-09-18
Method for manufacturing semiconductor device Grant 8,191,758 - Sawada , et al. June 5, 2	2012-06-05
Stacked electronic component and manufacturing method thereof App 20110281396 - Yoshimura; Atsushi ; et al.	2011-11-17
Stacked electronic component and manufacturing method thereof Grant 8,008,763 - Yoshimura , et al. August 30, 2	2011-08-30
Method For Manufacturing Semiconductor Device App 20100320258 - Sawada; Kanako ; et al.	2010-12-23
Stacked electronic component and manufacturing method thereof Grant 7,629,695 - Yoshimura , et al. December 8, 2	2009-12-08
Stacked electronic component and manufacturing method thereof App 20080197470 - Yoshimura; Atsushi ; et al.	2008-08-21
Stacked electronic component and manufacturing method thereof App 20060139893 - Yoshimura; Atsushi ; et al.	2006-06-29

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.