KOMORI; Kiyotaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for KOMORI; Kiyotaka.The latest application filed is for "metal clad laminated plate and method for manufacturing metal clad laminated plate".

Company Profile

7.14.17

KOMORI; Kiyotaka - Mie JP
Komori; Kiyotaka - Fukushima JP
Komori; Kiyotaka - Kadoma JP
Komori, Kiyotaka - Kadoma-shi Osaka JP
Komori, Kiyotaka - Kouriyama-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal Clad Laminated Plate And Method For Manufacturing Metal Clad Laminated Plate App 20210400810 - KOYAMA; Masaya ; et al.	2021-12-23
Printed wiring board and method for manufacturing printed wiring board Grant 11,039,533 - Takahashi , et al. June 15, 2	2021-06-15
Multilayer Printed Wiring Board, Multilayer Metal-clad Laminated Board, And Resin-coated Metal Foil App 20210176854 - TAKAHASHI; Hiroaki ; et al.	2021-06-10
Metal-clad Laminate And Method For Manufacturing The Same App 20200346437 - TAKAHASHI; Hiroaki ; et al.	2020-11-05
Printed Wiring Board And Method For Manufacturing Printed Wiring Board App 20200205286 - TAKAHASHI; Hiroaki ; et al.	2020-06-25
Method for manufacturing metal clad laminated board, method for manufacturing electronic circuit board, and rigid body pendulum type viscoelasticity measuring device Grant 10,668,697 - Koyama , et al.	2020-06-02
Metal-clad Laminate And Method For Manufacturing Same App 20200114623 - TAKAHASHI; Hiroaki ; et al.	2020-04-16
Multilayer printed wiring board and multilayer metal clad laminated board Grant 10,568,201 - Takahashi , et al. Feb	2020-02-18
Method For Manufacturing Metal Clad Laminated Board, Method For Manufacturing Electronic Circuit Board, And Rigid Body Pendulum Type Viscoelasticity Measuring Device App 20190134951 - KOYAMA; MASAYA ; et al.	2019-05-09
Multilayer Printed Wiring Board And Multilayer Metal Clad Laminated Board App 20180376579 - TAKAHASHI; Hiroaki ; et al.	2018-12-27
Multilayer Printed Wiring Board, Multilayer Metal-clad Laminated Board, And Resin-coated Metal Foil App 20180270945 - TAKAHASHI; Hiroaki ; et al.	2018-09-20
Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board Grant 9,775,239 - Arisawa , et al. September 26, 2	2017-09-26
Prepreg, laminate, metal foil-clad laminate, circuit board and LED module Grant 9,730,320 - Matsuda , et al. August 8, 2	2017-08-08
Thermosetting resin composition, prepreg, laminate, metal foil-clad laminate, and circuit board Grant 9,718,941 - Matsuda , et al. August 1, 2	2017-08-01
Resin Composition For Printed Wiring Board, Prepreg, Metal-clad Laminate, And Printed Wiring Board App 20170099731 - ARISAWA; TATSUYA ; et al.	2017-04-06
Printed wiring board Grant 9,307,636 - Kato , et al. April 5, 2	2016-04-05
Printed Wiring Board App 20140158406 - Kato; Hiroaki ; et al.	2014-06-12
Thermosetting Resin Composition, Prepreg, Laminate, Metal Foil-clad Laminate, And Circuit Board App 20140087614 - Matsuda; Takashi ; et al.	2014-03-27
Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mounting Grant 8,603,624 - Matsuda , et al. December 10, 2	2013-12-10
Prepreg, Laminate, Metal Foil-clad Laminate, Circuit Board And Led Module App 20130215628 - Matsuda; Takashi ; et al.	2013-08-22
Prepreg, Laminate, Metal-foil-clad Laminate, Circuit Board, And Circuit Board For Led Mounting App 20120228010 - Matsuda; Takashi ; et al.	2012-09-13
Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board Grant 7,288,587 - Saitou , et al. October 30, 2	2007-10-30
Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board App 20040132925 - Saitou, Eiitirou ; et al.	2004-07-08
Epoxy resin composition, prepreg and metal-clad laminate App 20020049264 - Maekawa, Tetsuya ; et al.	2002-04-25
Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material Grant 5,284,807 - Komori , et al. February 8, 1	1994-02-08

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