Komiyatani; Toshio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Komiyatani; Toshio.The latest application filed is for "heat conductive sheet and structure".

Company Profile

0.6.14

Komiyatani; Toshio - Tokyo JP
Komiyatani; Toshio - Akita N/A JP
Komiyatani; Toshio - Fujieda JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat Conductive Sheet And Structure App 20150371923 - Komiyatani; Toshio ; et al.	2015-12-24
Metal Foil-clad Substrate, Circuit Board And Heating-element Mounting Substrate App 20150366047 - Okasaka; Shu ; et al.	2015-12-17
Metal Foil-clad Substrate, Circuit Board And Electronic-component Mounting Substrate App 20150366054 - Okasaka; Shu ; et al.	2015-12-17
Metal-based Mounting Board And Member Provided With Metal-based Mounting Board App 20150351224 - Nii; Yoshihide ; et al.	2015-12-03
Metal-based Mounting Board And Method Of Manufacturing Metal-based Mounting Board App 20150351225 - Nii; Yoshihide ; et al.	2015-12-03
Metal-based Mounting Board And Member Provided With Metal-based Mounting Board App 20150351223 - Nii; Yoshihide ; et al.	2015-12-03
Adhesive film Grant 8,597,785 - Komiyatani , et al. December 3, 2	2013-12-03
Conductive paste Grant 8,062,558 - Obata , et al. November 22, 2	2011-11-22
Process for manufacturing circuit board Grant 8,042,263 - Kondo , et al. October 25, 2	2011-10-25
Multilayer Wiring Board And Semiconductor Device App 20110120754 - Kondo; Masayoshi ; et al.	2011-05-26
Resin Composition, Carrier Material With Resin, Multi-layered Printed Circuit Board, And Semiconductor Device App 20110031000 - Komiyatani; Toshio ; et al.	2011-02-10
Circuit Board And Method For Manufacturing The Same App 20100326712 - Kondo; Masayoshi ; et al.	2010-12-30
Process For Manufacturing Circuit Board And Circuit Board App 20100212937 - Kondo; Masayoshi ; et al.	2010-08-26
Adhesive Tape App 20100203307 - Komiyatani; Toshio ; et al.	2010-08-12
Conductive Paste App 20100044648 - Obata; Hiroshi ; et al.	2010-02-25
Resin Composition, Resin Film, Cover Lay Film, Interlayer Adhesive, Metal-clad Laminate And Multilayer Printed Circuit Board App 20100012362 - Abe; Tomoyuki ; et al.	2010-01-21
Multi-layer circuit board and method for manufacturing same App 20040148766 - Noguchi, Jinichi ; et al.	2004-08-05
Interlaminar insulating adhesive for multilayer printed circuit board Grant 6,447,915 - Komiyatani , et al. September 10, 2	2002-09-10
Adhesive for printed circuit board Grant 5,571,365 - Maehata , et al. November 5, 1	1996-11-05

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