loadpatents
Patent applications and USPTO patent grants for KOMINO; Mitsuaki.The latest application filed is for "apparatus for processing a substrate".
Patent | Date |
---|---|
Apparatus For Processing A Substrate App 20210156031 - PARK; Sungyong ;   et al. | 2021-05-27 |
Heating Apparatus App 20100200566 - Komino; Mitsuaki ;   et al. | 2010-08-12 |
Deposition Apparatus For Organic El And Evaporating Apparatus App 20100000469 - Yagi; Yasushi ;   et al. | 2010-01-07 |
Magnetic Fluid Seal Device App 20090179385 - Komino; Mitsuaki ;   et al. | 2009-07-16 |
Electrode, susceptor, plasma processing apparatus and method of making the electrode and the susceptor Grant 7,337,745 - Komino , et al. March 4, 2 | 2008-03-04 |
Semiconductor manufacturing device and its heating unit App 20070034159 - Komino; Mitsuaki ;   et al. | 2007-02-15 |
Plasma processing apparatus, and electrode structure and table structure of processing apparatus Grant 7,033,444 - Komino , et al. April 25, 2 | 2006-04-25 |
Transfer module and cluster system for semiconductor manufacturing process Grant 6,634,845 - Komino October 21, 2 | 2003-10-21 |
Plasma treatment method and apparatus Grant 6,544,380 - Tomoyasu , et al. April 8, 2 | 2003-04-08 |
Plasma treatment method and apparatus App 20020088547 - Tomoyasu, Masayuki ;   et al. | 2002-07-11 |
Plasma processor, cluster tool, and method of controlling plasma App 20010054484 - Komino, Mitsuaki | 2001-12-27 |
Plasma treatment method and apparatus App 20010027843 - Komino, Mitsuaki ;   et al. | 2001-10-11 |
Plasma treatment method and apparatus App 20010023744 - Komino, Mitsuaki | 2001-09-27 |
Plasma treatment method and apparatus Grant 6,264,788 - Tomoyasu , et al. July 24, 2 | 2001-07-24 |
Method and system for controlling gas system Grant 6,167,323 - Komino , et al. December 26, 2 | 2000-12-26 |
Plasma processing apparatus Grant 6,156,151 - Komino , et al. December 5, 2 | 2000-12-05 |
Drying processing method and apparatus using same Grant 6,134,807 - Komino , et al. October 24, 2 | 2000-10-24 |
Method and device for controlling pressure and flow rate Grant 6,131,307 - Komino , et al. October 17, 2 | 2000-10-17 |
Plasma treatment method utilizing an amplitude-modulated high frequency power Grant 6,106,737 - Tomoyasu , et al. August 22, 2 | 2000-08-22 |
Reduced pressure and normal pressure treatment apparatus Grant 5,769,952 - Komino June 23, 1 | 1998-06-23 |
Treatment apparatus Grant 5,753,891 - Iwata , et al. May 19, 1 | 1998-05-19 |
Plasma processing apparatus Grant 5,665,166 - Deguchi , et al. September 9, 1 | 1997-09-09 |
Electrostatic chuck Grant 5,625,526 - Watanabe , et al. April 29, 1 | 1997-04-29 |
Treatment apparatus control method Grant 5,584,971 - Komino December 17, 1 | 1996-12-17 |
Method of forming a bonding portion Grant 5,581,874 - Aoki , et al. December 10, 1 | 1996-12-10 |
Vacuum exhaust system for processing apparatus Grant 5,575,853 - Arami , et al. November 19, 1 | 1996-11-19 |
Method of controlling temperature of susceptor Grant 5,567,267 - Kazama , et al. October 22, 1 | 1996-10-22 |
Plasma process apparatus Grant 5,478,429 - Komino , et al. December 26, 1 | 1995-12-26 |
Stage having electrostatic chuck and plasma processing apparatus using same Grant 5,382,311 - Ishikawa , et al. January 17, 1 | 1995-01-17 |
Plasma processing apparatus Grant 5,376,213 - Ueda , et al. December 27, 1 | 1994-12-27 |
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