Komatsu; Shingo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Komatsu; Shingo.The latest application filed is for "field-effect transistor and method for manufacturing the same".

Company Profile

0.30.29

Komatsu; Shingo - Osaka N/A JP
Komatsu; Shingo - Kadoma JP
Komatsu; Shingo - Katano JP
Komatsu; Shingo - Kadoma-shi JP
Komatsu; Shingo - Katano-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Field-effect transistor and method for manufacturing the same Grant 8,871,567 - Hirano , et al. October 28, 2	2014-10-28
Flip-chip mounting resin composition and bump forming resin composition Grant 8,709,293 - Kitae , et al. April 29, 2	2014-04-29
Method for making a semiconductor device on a flexible substrate Grant 8,617,943 - Ichiryu , et al. December 31, 2	2013-12-31
Field-effect Transistor And Method For Manufacturing The Same App 20130032797 - Hirano; Koichi ; et al.	2013-02-07
Semiconductor device and manufacturing process thereof Grant 8,344,264 - Kumano , et al. January 1, 2	2013-01-01
Mounted body and method for manufacturing the same Grant 8,039,307 - Kojima , et al. October 18, 2	2011-10-18
Manufacturing method of flexible semiconductor device and flexible semiconductor device Grant 7,977,741 - Hirano , et al. July 12, 2	2011-07-12
Electronic component mounting method Grant 7,921,551 - Yamashita , et al. April 12, 2	2011-04-12
Mounted body and method for manufacturing the same Grant 7,911,064 - Komatsu , et al. March 22, 2	2011-03-22
Manufacturing Method Of Flexible Semiconductor Device And Flexible Semiconductor Device App 20110049598 - HIRANO; Koichi ; et al.	2011-03-03
Transfer material used for producing a wiring substrate Grant 7,888,789 - Sugaya , et al. February 15, 2	2011-02-15
Manufacturing method of flexible semiconductor device and flexible semiconductor device Grant 7,851,281 - Hirano , et al. December 14, 2	2010-12-14
Method For Fabricating Flexible Semiconductor Device And Layered Film Used Therefore App 20100276691 - Ichiryu; Takashi ; et al.	2010-11-04
Mounted Body And Method For Manufacturing The Same App 20100224986 - Kojima; Toshiyuki ; et al.	2010-09-09
Mounted body and method for manufacturing the same Grant 7,713,787 - Kojima , et al. May 11, 2	2010-05-11
Manufacturing Method Of Flexible Semiconductor Device And Flexible Semiconductor Device App 20100012936 - Hirano; Koichi ; et al.	2010-01-21
Semiconductor Device And Manufacturing Process Thereof App 20090321124 - KUMANO; Yutaka ; et al.	2009-12-31
Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition Grant 7,611,040 - Kitae , et al. November 3, 2	2009-11-03
Mounted Body And Method For Manufacturing The Same App 20090230546 - Komatsu; Shingo ; et al.	2009-09-17
Electronic Component Mounting Method and Electronic Circuit Device App 20090223705 - Yamashita; Yoshihisa ; et al.	2009-09-10
Mounted Body and Method for Manufacturing the Same App 20080251894 - Kojima; Toshiyuki ; et al.	2008-10-16
Method for Forming Solder Bump and Method for Mounting Semiconductor Device App 20080197173 - Kitae; Takashi ; et al.	2008-08-21
Semiconductor device and method for manufacturing the same Grant 7,390,692 - Sugaya , et al. June 24, 2	2008-06-24
Flip-Chip Mounting Resin Composition and Bump Forming Resin Composition App 20080128664 - Kitae; Takashi ; et al.	2008-06-05
Component built-in module and method for producing the same Grant 7,294,587 - Asahi , et al. November 13, 2	2007-11-13
Component built-in module and method for producing the same Grant 7,198,996 - Nakatani , et al. April 3, 2	2007-04-03
Semiconductor device and method for manufacturing the same Grant 7,157,789 - Hirano , et al. January 2, 2	2007-01-02
Semiconductor device and method for manufacturing the same App 20060290009 - Sugaya; Yasuhiro ; et al.	2006-12-28
Semiconductor device and method for manufacturing the same Grant 7,132,756 - Sugaya , et al. November 7, 2	2006-11-07
Semiconductor module, process for producing the same, and film interposer App 20060091524 - Karashima; Seiji ; et al.	2006-05-04
Circuit component built-in module with embedded semiconductor chip and method of manufacturing Grant 7,018,866 - Sugaya , et al. March 28, 2	2006-03-28
Component built-in module and method for producing the same Grant 6,975,516 - Asahi , et al. December 13, 2	2005-12-13
Component built-in module and method for producing the same App 20050269681 - Asahi, Toshiyuki ; et al.	2005-12-08
Semiconductor device and method for manufacturing the same App 20050263860 - Hirano, Koichi ; et al.	2005-12-01
Component built-in module and method for producing the same App 20050230848 - Nakatani, Seiichi ; et al.	2005-10-20
Method of manufacturing a component built-in module Grant 6,955,948 - Asahi , et al. October 18, 2	2005-10-18
Component built-in module and method for producing the same Grant 6,939,738 - Nakatani , et al. September 6, 2	2005-09-06
Wiring substrate produced by transfer material method Grant 6,936,774 - Sugaya , et al. August 30, 2	2005-08-30
Wiring substrate produced by transfer material method App 20050186768 - Sugaya, Yasuhiro ; et al.	2005-08-25
Transfer material for wiring substrate Grant 6,871,396 - Sugaya , et al. March 29, 2	2005-03-29
Insulation sheet, multi-layer wiring substrate and production processes thereof Grant 6,855,892 - Komatsu , et al. February 15, 2	2005-02-15
Circuit component built-in module with embedded semiconductor chip and method of manufacturing Grant 6,784,530 - Sugaya , et al. August 31, 2	2004-08-31
Component built-in module and method for producing the same App 20040158980 - Nakatani, Seiichi ; et al.	2004-08-19
Circuit component built-in module with embedded semiconductor chip and method of manufacturing App 20040145044 - Sugaya, Yasuhiro ; et al.	2004-07-29
Component built-in module and method for producing the same Grant 6,734,542 - Nakatani , et al. May 11, 2	2004-05-11
Semiconductor device and method for manufacturing the same App 20040084769 - Sugaya, Yasuhiro ; et al.	2004-05-06
Circuit component built-in module and method of manufacturing the same App 20030137045 - Sugaya, Yasuhiro ; et al.	2003-07-24
Transfer material method for producing the same and wiring substrate produced by using the same App 20030102153 - Sugaya, Yasuhiro ; et al.	2003-06-05
Component built-in module and method for producing the same App 20030090883 - Asahi, Toshiyuki ; et al.	2003-05-15
Insulation sheet and multi-layer wiring substrate and production processes thereof App 20030085058 - Komatsu, Shingo ; et al.	2003-05-08
Component built-in module and method of manufacturing the same App 20030062624 - Asahi, Toshiyuki ; et al.	2003-04-03
Component built-in module and method of manufacturing the same Grant 6,489,685 - Asahi , et al. December 3, 2	2002-12-03
Component built-in module and method of manufacturing the same App 20020135058 - Asahi, Toshiyuki ; et al.	2002-09-26
Component built-in module and method for producing the same App 20020117743 - Nakatani, Seiichi ; et al.	2002-08-29
Transfer material, method for producing the same and wiring substrate produced by using the same App 20010023779 - Sugaya, Yasuhiro ; et al.	2001-09-27