Komatsu; Ryuji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Komatsu; Ryuji.The latest application filed is for "substrate for semiconductor device and semiconductor device".
- Komatsu; Ryuji - Okaya JP
- Komatsu; Ryuji - Okaya-shi JP
| Patent | Date |
|---|---|
| Method for forming component mounting hole in semiconductor substrate Grant 7,348,213 - Komatsu March 25, 2 | 2008-03-25 |
| Substrate for semiconductor device and semiconductor device App 20070063343 - Komatsu; Ryuji | 2007-03-22 |
| Substrate for semiconductor devices and semiconductor device App 20060138638 - Komatsu; Ryuji | 2006-06-29 |
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