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Komatsu; Ikuo Patent Filings

Komatsu; Ikuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Komatsu; Ikuo.The latest application filed is for "container in which inner surface is formed from olefin resin layer".

Company Profile
2.19.21
  • Komatsu; Ikuo - Yokohama-shi JP
  • Komatsu; Ikuo - Kanagawa JP
  • Komatsu; Ikuo - Yokohama JP
  • Komatsu; Ikuo - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Container In Which Inner Surface Is Formed From Olefin Resin Layer
App 20220033142 - Komatsu; Ikuo ;   et al.
2022-02-03
Blow-formed Container Having Inner Surface Provided With Oil Film For Use
App 20200207503 - AKUTSU; Yosuke ;   et al.
2020-07-02
Parison supply device and supply method, and blow molding machine and blow molding method using same
Grant 10,632,666 - Hirota , et al.
2020-04-28
Structured Body Having Oil Film On Surface Thereof
App 20200123464 - AKUTSU; Yosuke ;   et al.
2020-04-23
Method of filling viscous content
Grant 10,392,138 - Komatsu , et al. A
2019-08-27
Container In Which Inner Surface Is Formed From Olefin Resin Layer
App 20180162595 - KOMATSU; Ikuo ;   et al.
2018-06-14
Parison Supply Device And Supply Method, And Blow Molding Machine And Blow Molding Method Using Same
App 20170173842 - HIROTA; Norihisa ;   et al.
2017-06-22
Method Of Filling Viscous Content
App 20170144783 - KOMATSU; Ikuo ;   et al.
2017-05-25
Parison supply device and supply method
Grant 9,636,865 - Hirota , et al. May 2, 2
2017-05-02
Containers of a multilayered structure
Grant 9,550,601 - Komatsu , et al. January 24, 2
2017-01-24
Polyethylene resin composition and containers using the same
Grant 9,475,926 - Akutsu , et al. October 25, 2
2016-10-25
Parison Supply Device And Supply Method
App 20160039139 - HIROTA; Norihisa ;   et al.
2016-02-11
Containers Of A Multilayered Structure
App 20150041465 - Komatsu; Ikuo ;   et al.
2015-02-12
Polyethylene Resin Composition And Containers Using The Same
App 20140309348 - Akutsu; Yosuke ;   et al.
2014-10-16
Thermoplastic resin pellets and method for preparing same
Grant 8,809,465 - Komatsu , et al. August 19, 2
2014-08-19
Oxygen-absorbing resin composition and laminate
Grant 8,592,522 - Komatsu , et al. November 26, 2
2013-11-26
Plastic multi-layer structure
Grant 8,216,651 - Ohta , et al. July 10, 2
2012-07-10
Semiconductor device
Grant 7,723,837 - Tanaka , et al. May 25, 2
2010-05-25
Oxygen-absorbing resin composition
Grant 7,709,567 - Goto , et al. May 4, 2
2010-05-04
Thermoplastic Resin Pellets And Method For Preparing Same
App 20100048825 - Komatsu; Ikuo ;   et al.
2010-02-25
Preform, Method Of Producing The Same, And Biaxially Drawn Container Made From The Preform
App 20090317577 - Kikuchi; Atsushi ;   et al.
2009-12-24
Composite synthetic resin material forming method and apparatus
Grant 7,341,684 - Imatani , et al. March 11, 2
2008-03-11
Plastic multi-layer structure
App 20070042145 - Ohta; Yoshihiro ;   et al.
2007-02-22
Oxygen-absorbing resin composition
App 20060211811 - Goto; Hiroaki ;   et al.
2006-09-21
Semiconductor device
App 20060170113 - Tanaka; Takekazu ;   et al.
2006-08-03
Preform, process for producing the same, and biaxially stretched container obtained from the preform
App 20060127615 - Kikuchi; Atsushi ;   et al.
2006-06-15
Method and sevice for forming composite synthetic resin material
App 20060051444 - Imatani; Tsuneo ;   et al.
2006-03-09
Oxygen-absorbing resin composition and laminate
App 20050142373 - Komatsu, Ikuo ;   et al.
2005-06-30
Resin composition and multi-layer container using the same
Grant 6,878,774 - Kikuchi , et al. April 12, 2
2005-04-12
Resin composition and multi-layer container using the same
App 20040176536 - Kikuchi, Atsushi ;   et al.
2004-09-09
Packaging material and multi-layer container
Grant 6,680,094 - Kikuchi , et al. January 20, 2
2004-01-20
Packaging material and multi-layer container
App 20020146527 - Kikuchi, Atsushi ;   et al.
2002-10-10
Resin composition and multi-layer container using the same
App 20020115768 - Kikuchi, Atsushi ;   et al.
2002-08-22
Method for manufacturing thermoplastic resin molded semiconductor
Grant 5,563,103 - Komatsu October 8, 1
1996-10-08
Thickness-reduced draw-formed can
Grant 5,360,649 - Sato , et al. November 1, 1
1994-11-01
Vessel lid comprising laminated material
Grant 5,112,695 - Watanabe , et al. May 12, 1
1992-05-12

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