Komatsu Electronic Metal Co., Ltd.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Komatsu Electronic Metal Co., Ltd..The latest application filed is for "silicon wafer for hydrogen heat treatment and method for manufacturing the same".
- Komatsu Electronic Metal Co., Ltd. - Kanagawa JP
- Komatsu Electronic Metal Co., Ltd. - Hiratsuka JP
| Patent | Date |
|---|---|
| Silicon wafer for hydrogen heat treatment and method for manufacturing the same Grant 6,056,931 - Saishoji , et al. May 2, 2 | 2000-05-02 |
| Method of making semiconductor wafers Grant 5,963,821 - Kai , et al. October 5, 1 | 1999-10-05 |
| Semiconductor single-crystal lift device Grant 5,868,836 - Nakamura , et al. February 9, 1 | 1999-02-09 |
| Method for fabricating an SOI substrate Grant 5,866,468 - Kono , et al. February 2, 1 | 1999-02-02 |
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