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name:-0.169438123703
name:-0.0015950202941895
KOMADA; Daisuke Patent Filings

KOMADA; Daisuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for KOMADA; Daisuke.The latest application filed is for "optical connector ferrule, optical connector, and composite fiber connecting assembly".

Company Profile
1.7.10
  • KOMADA; Daisuke - Omihachiman-shi JP
  • Komada; Daisuke - Kitami-shi JP
  • Komada; Daisuke - Kasugai JP
  • Komada, Daisuke - Kasugai-shi JP
  • Komada; Daisuke - Kitami JP
  • Komada; Daisuke - Aichi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Optical Connector Ferrule, Optical Connector, And Composite Fiber Connecting Assembly
App 20210181434 - KOMADA; Daisuke ;   et al.
2021-06-17
Ceramic Guide, Ceramic Guide Device, And Cermic Guide Module
App 20210045688 - KOMADA; Daisuke ;   et al.
2021-02-18
Spot Pin, Spot Device, Liquid Spotting Method, and Method of Manufacturing Unit for Biochemical Analysis
App 20090093379 - Komada; Daisuke
2009-04-09
Semiconductor device with dual damascene wiring
Grant 7,119,009 - Watanabe , et al. October 10, 2
2006-10-10
Semiconductor device with dual damascene wiring
App 20050001323 - Watanabe, Kenichi ;   et al.
2005-01-06
Manufacture method for semiconductor device having silicon-containing insulating film
Grant 6,787,474 - Komada September 7, 2
2004-09-07
Semiconductor device with dual damascene wiring
Grant 6,787,907 - Watanabe , et al. September 7, 2
2004-09-07
Optical device module
Grant 6,769,819 - Tanaka , et al. August 3, 2
2004-08-03
Semiconductor device manufacturing method
Grant 6,627,554 - Komada September 30, 2
2003-09-30
Method for manufacturing a semiconductor device
Grant 6,599,841 - Komada July 29, 2
2003-07-29
Method of manufacturing semiconductor device having silicon carbide film
App 20030068582 - Komada, Daisuke ;   et al.
2003-04-10
Manufacture method for semiconductor device having silicon-containing insulating film
App 20030064603 - Komada, Daisuke
2003-04-03
Semiconductor integrated circuit device with moisture-proof ring and its manufacture method
Grant 6,498,089 - Komada December 24, 2
2002-12-24
Semiconductor integrated circuit device with moisture-proof ring and its manufacture method
App 20020125577 - Komada, Daisuke
2002-09-12
Semiconductor device with dual damascene wiring
App 20020008323 - Watanabe, Kenichi ;   et al.
2002-01-24
Optical device module
App 20010026664 - Tanaka, Tsuyoshi ;   et al.
2001-10-04
Method For Manufacturing A Semiconductor Device
App 20010003675 - KOMADA, DAISUKE
2001-06-14

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