| Patent | Date |
|---|
Magnetic coils in locally thinned silicon bridges and methods of assembling same
Grant 11,456,116 - Augustin , et al. September 27, 2 | 2022-09-27 |
Patch Antennas Stitched To Systems In Packages And Methods Of Assembling Same
App 20220294115 - Augustin; Andreas ; et al. | 2022-09-15 |
Integrated circuit devices with front-end metal structures
Grant 11,410,908 - Mahnkopf , et al. August 9, 2 | 2022-08-09 |
Patch antennas stitched to systems in packages and methods of assembling same
Grant 11,374,323 - Augustin , et al. June 28, 2 | 2022-06-28 |
Printed Wiring-board Islands For Connecting Chip Packages And Methods Of Assembling Same
App 20220015244 - Seidemann; Georg ; et al. | 2022-01-13 |
Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus
Grant 11,145,577 - Koller , et al. October 12, 2 | 2021-10-12 |
Printed wiring-board islands for connecting chip packages and methods of assembling same
Grant 11,134,573 - Seidemann , et al. September 28, 2 | 2021-09-28 |
Contoured-on-heat-sink, wrapped printed wiring boards for system-in-package apparatus
Grant 11,037,855 - Koller , et al. June 15, 2 | 2021-06-15 |
Single Metal Cavity Antenna In Package Connected To An Integrated Transceiver Front-end
App 20200373259 - KOLLER; Sonja ; et al. | 2020-11-26 |
Package Integrated Cavity Resonator Antenna
App 20200365996 - ROTH; Kilian ; et al. | 2020-11-19 |
Printed Wiring-board Islands For Connecting Chip Packages And Methods Of Assembling Same
App 20200352035 - Seidemann; Georg ; et al. | 2020-11-05 |
Semiconductor Packages, and Methods for Forming Semiconductor Packages
App 20200227388 - Waidhas; Bernd ; et al. | 2020-07-16 |
Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device
Grant 10,658,201 - Koller , et al. | 2020-05-19 |
Interposer with conductive routing exposed on sidewalls
Grant 10,651,102 - Reingruber , et al. | 2020-05-12 |
Patch Antennas Stitched To Systems In Packages And Methods Of Assembling Same
App 20200144723 - Augustin; Andreas ; et al. | 2020-05-07 |
Power mesh-on-die trace bumping
Grant 10,629,731 - Waidhas , et al. | 2020-04-21 |
Magnetic Coils In Locally Thinned Silicon Bridges And Methods Of Assembling Same
App 20200111607 - Augustin; Andreas ; et al. | 2020-04-09 |
Contoured-on-heat-sink, Wrapped Printed Wiring Boards For System-in-package Apparatus
App 20200043826 - Koller; Sonja ; et al. | 2020-02-06 |
Semiconductor devices, and a method for forming a semiconductor device
Grant 10,535,578 - Mahnkopf , et al. Ja | 2020-01-14 |
Thermal Contacts At Periphery Of Integrated Circuit Packages
App 20190393125 - Koller; Sonja ; et al. | 2019-12-26 |
Integrated Circuit Devices With Front-end Metal Structures
App 20190393130 - Mahnkopf; Reinhard ; et al. | 2019-12-26 |
Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device
App 20190295857 - Koller; Sonja ; et al. | 2019-09-26 |
Electromagnetic Shielding Cap, An Electrical System And A Method For Forming An Electromagnetic Shielding Cap
App 20190297758 - KOLLER; Sonja ; et al. | 2019-09-26 |
Lead Frame With Angular Deflections And Wrapped Printed Wiring Boards For System-in-package Apparatus
App 20190267312 - Koller; Sonja ; et al. | 2019-08-29 |
Integrated circuit package configurations to reduce stiffness
Grant 10,373,844 - Albers , et al. | 2019-08-06 |
Thermal Conduction Devices And Methods For Embedded Electronic Devices
App 20190214327 - Koller; Sonja ; et al. | 2019-07-11 |
Low thermal resistance hanging die package
Grant 10,347,558 - Geissler , et al. July 9, 2 | 2019-07-09 |
Interposer With Angled Vias
App 20190206777 - Koller; Sonja ; et al. | 2019-07-04 |
Power Mesh-on-die Trace Bumping
App 20190207027 - Waidhas; Bernd ; et al. | 2019-07-04 |
Anisotropically Conductive Elastic Adhesive Films In Semiconductor Device Packages And Methods Of Assembling Same
App 20190198448 - Koller; Sonja ; et al. | 2019-06-27 |
Power mesh-on-die trace bumping
Grant 10,263,106 - Waidhas , et al. | 2019-04-16 |
Semiconductor devices, and a Method for Forming a Semiconductor device
App 20190103333 - Mahnkopf; Reinhard ; et al. | 2019-04-04 |
Smart Accelerometer Cantilever
App 20190004083 - Koller; Sonja ; et al. | 2019-01-03 |
Interposer With Conductive Routing Exposed On Sidewalls
App 20180342431 - Reingruber; Klaus ; et al. | 2018-11-29 |
Cooler for semiconductor devices
Grant 10,121,726 - Albers , et al. November 6, 2 | 2018-11-06 |
Power Mesh-on-die Trace Bumping
App 20180286798 - Waidhas; Bernd ; et al. | 2018-10-04 |
Filler Interface Heat Transfer System And Devices And Methods For Same
App 20180284851 - Seidemann; Georg ; et al. | 2018-10-04 |
Device with switchable heat path
Grant 10,091,866 - Koller , et al. October 2, 2 | 2018-10-02 |
Low Thermal Resistance Hanging Die Package
App 20180218962 - GEISSLER; Christian ; et al. | 2018-08-02 |
Device With Switchable Heat Path
App 20180177037 - Koller; Sonja ; et al. | 2018-06-21 |
Wearable Computing Device
App 20180150156 - Albers; Sven ; et al. | 2018-05-31 |
Wearable computing device
Grant 9,921,694 - Albers , et al. March 20, 2 | 2018-03-20 |
Integrated Circuit Package Configurations To Reduce Stiffness
App 20170345678 - Albers; Sven ; et al. | 2017-11-30 |
Flip-chip Package With Thermal Dissipation Layer
App 20170178999 - Patten; Richard ; et al. | 2017-06-22 |
Integrated circuit package configurations to reduce stiffness
Grant 9,653,324 - Albers , et al. May 16, 2 | 2017-05-16 |
Cooler For Semiconductor Devices
App 20170062306 - Albers; Sven ; et al. | 2017-03-02 |
Integrated Circuit Package Configurations To Reduce Stiffness
App 20160293453 - Albers; Sven ; et al. | 2016-10-06 |
Wearable Computing Device
App 20160224148 - ALBERS; Sven ; et al. | 2016-08-04 |
Integrated circuit package configurations to reduce stiffness
Grant 9,397,019 - Albers , et al. July 19, 2 | 2016-07-19 |
Contact pads for integrated circuit packages
Grant 9,368,461 - Albers , et al. June 14, 2 | 2016-06-14 |
Contact Pads For Integrated Circuit Packages
App 20150333022 - Albers; Sven ; et al. | 2015-11-19 |
Integrated Circuit Package Configurations To Reduce Stiffness
App 20150243572 - Albers; Sven ; et al. | 2015-08-27 |
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