Kolics; Artur

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kolics; Artur.The latest application filed is for "vacuum-integrated hardmask processes and apparatus".

Company Profile

3.72.68

Kolics; Artur - Lake Oswego OR
Kolics; Artur - Dublin CA
Kolics; Artur - Fremont CA
Kolics; Artur - San Jose CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Vacuum-integrated Hardmask Processes And Apparatus App 20220075260 - Marks; Jeffrey ; et al.	2022-03-10
Vacuum-integrated hardmask processes and apparatus Grant 11,209,729 - Marks , et al. December 28, 2	2021-12-28
Vacuum-integrated hardmask processes and apparatus Grant 10,831,096 - Marks , et al. November 10, 2	2020-11-10
Vacuum-integrated Hardmask Processes And Apparatus App 20200089104 - Marks; Jeffrey ; et al.	2020-03-19
Vacuum-integrated hardmask processes and apparatus Grant 10,514,598 - Marks , et al. Dec	2019-12-24
Via Prefill In A Fully Aligned Via App 20190363048 - Zhao; Lie ; et al.	2019-11-28
Interlevel conductor pre-fill utilizing selective barrier deposition Grant 10,262,943 - Kolics , et al.	2019-04-16
Vacuum-integrated Hardmask Processes And Apparatus App 20190094685 - Marks; Jeffrey ; et al.	2019-03-28
Methods for wet metal seed deposition for bottom up gapfill of features Grant 10,103,056 - Tan , et al. October 16, 2	2018-10-16
Metallization of the wafer edge for optimized electroplating performance on resistive substrates Grant 10,079,207 - Kolics September 18, 2	2018-09-18
Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor Grant 10,049,921 - Draeger , et al. August 14, 2	2018-08-14
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition App 20180151503 - Kolics; Artur ; et al.	2018-05-31
Interlevel conductor pre-fill utilizing selective barrier deposition Grant 9,875,968 - Kolics , et al. January 23, 2	2018-01-23
Vacuum-integrated Hardmask Processes And Apparatus App 20180004083 - Marks; Jeffrey ; et al.	2018-01-04
Atomic layer etching for enhanced bottom-up feature fill Grant 9,837,312 - Tan , et al. December 5, 2	2017-12-05
Metallization Of The Wafer Edge For Optimized Electroplating Performance On Resistive Substrates App 20170330831 - Kolics; Artur	2017-11-16
Method of electroless plating using a solution with at least two borane containing reducing agents Grant 9,818,617 - Kolics , et al. November 14, 2	2017-11-14
Vacuum-integrated hardmask processes and apparatus Grant 9,778,561 - Marks , et al. October 3, 2	2017-10-03
Dual damascene fill Grant 9,768,063 - Kolics , et al. September 19, 2	2017-09-19
Metallization of the wafer edge for optimized electroplating performance on resistive substrates Grant 9,761,524 - Kolics September 12, 2	2017-09-12
Pre-fill Wafer Cleaning Formulation App 20170207091 - Kolics; Artur	2017-07-20
Pre-fill wafer cleaning formulation Grant 9,691,622 - Kolics June 27, 2	2017-06-27
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition App 20170162512 - Kolics; Artur ; et al.	2017-06-08
Electroless Plating Solution With At Least Two Borane Containing Reducing Agents App 20170092499 - KOLICS; Artur ; et al.	2017-03-30
Interlevel conductor pre-fill utilizing selective barrier deposition Grant 9,583,386 - Kolics , et al. February 28, 2	2017-02-28
Electroless plating solution with at least two borane containing reducing agents Grant 9,551,074 - Kolics , et al. January 24, 2	2017-01-24
Copper interconnect Grant 9,490,211 - Zhao , et al. November 8, 2	2016-11-08
Wafer cleaning formulation Grant 9,476,018 - Kolics October 25, 2	2016-10-25
Two-step Deposition With Improved Selectivity App 20160273113 - KOLICS; Artur ; et al.	2016-09-22
Metallization Of The Wafer Edge For Optimized Electroplating Performance On Resistive Substrates App 20160254222 - Kolics; Artur	2016-09-01
Method of making an interconnect device Grant 9,406,556 - Kolics August 2, 2	2016-08-02
Methods and materials for anchoring gapfill metals Grant 9,382,627 - Kolics July 5, 2	2016-07-05
Pre-fill Wafer Cleaning Formulation App 20160189966 - Kolics; Artur	2016-06-30
Metallization of the wafer edge for optimized electroplating performance on resistive substrates Grant 9,368,340 - Kolics June 14, 2	2016-06-14
Two-step deposition with improved selectivity Grant 9,353,444 - Kolics , et al. May 31, 2	2016-05-31
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition App 20160118296 - Kolics; Artur ; et al.	2016-04-28
Using electroless deposition as a metrology tool to highlight contamination, residue, and incomplete via etch Grant 9,287,183 - Zhao , et al. March 15, 2	2016-03-15
Flowable Dielectric For Selective Ultra Low-k Pore Sealing App 20160056071 - Draeger; Nerissa Sue ; et al.	2016-02-25
Electroless Plating With At Least Two Borane Reducing Agents App 20150354064 - KOLICS; Artur ; et al.	2015-12-10
Metallization Of The Wafer Edge For Optimized Electroplating Performance On Resistive Substrates App 20150348772 - Kolics; Artur	2015-12-03
Electroless gap fill Grant 9,153,449 - Kolics October 6, 2	2015-10-06
Two-step Deposition With Improved Selectivity App 20150275374 - KOLICS; Artur ; et al.	2015-10-01
Method for capping copper interconnect lines Grant 9,142,456 - Dictus , et al. September 22, 2	2015-09-22
Process to reduce nodule formation in electroless plating Grant 9,142,416 - Li , et al. September 22, 2	2015-09-22
Method and apparatus for plating solution analysis and control Grant 9,128,493 - Rulkens , et al. September 8, 2	2015-09-08
Processes And Solutions For Substrate Cleaning And Electroless Deposition App 20150225679 - KOLICS; Artur ; et al.	2015-08-13
Vacuum-integrated Hardmask Processes And Apparatus App 20150221519 - Marks; Jeffrey ; et al.	2015-08-06
Cleaning solution formulations for substrates Grant 9,058,975 - Kolics , et al. June 16, 2	2015-06-16
Processes and solutions for substrate cleaning and electroless deposition Grant 9,048,088 - Kolics , et al. June 2, 2	2015-06-02
Through silicon via metallization Grant 9,029,258 - Nalla , et al. May 12, 2	2015-05-12
Wafer Cleaning Formulation App 20150111805 - Kolics; Artur	2015-04-23
Devices for metallization Grant 9,006,893 - Kolics , et al. April 14, 2	2015-04-14
Adhesion layer for through silicon via metallization Grant 8,980,746 - Kolics March 17, 2	2015-03-17
Metallization mixtures and electronic devices Grant 8,970,027 - Kolics , et al. March 3, 2	2015-03-03
Adhesion Layer For Through Silicon Via Metallization App 20150050808 - KOLICS; Artur	2015-02-19
Method For Capping Copper Interconnect Lines App 20150037973 - DICTUS; Dries ; et al.	2015-02-05
Methods And Materials For Anchoring Gapfill Metals App 20150033980 - KOLICS; Artur	2015-02-05
Post deposition wafer cleaning formulation Grant 8,921,296 - Kolics December 30, 2	2014-12-30
Apparatus and method for electroless deposition of materials on semiconductor substrates Grant 8,906,446 - Ivanov , et al. December 9, 2	2014-12-09
Methods and materials for anchoring gapfill metals Grant 8,895,441 - Kolics November 25, 2	2014-11-25
Method for strengthening adhesion between dielectric layers formed adjacent to metal layers Grant 8,808,791 - Ivanov , et al. August 19, 2	2014-08-19
Through Silicon Via Metallization App 20140217590 - NALLA; Praveen Reddy ; et al.	2014-08-07
Post-deposition cleaning methods for substrates with cap layers Grant 8,790,465 - Kolics , et al. July 29, 2	2014-07-29
Methods For Reducing Metal Oxide Surfaces To Modified Metal Surfaces App 20140199497 - Spurlin; Tighe A. ; et al.	2014-07-17
Methods and layers for metallization Grant 8,736,055 - Kolics , et al. May 27, 2	2014-05-27
Method Of Making An Interconnect Device App 20140099789 - Kolics; Artur	2014-04-10
Methods, Devices, And Materials For Metallization App 20140054776 - KOLICS; Artur ; et al.	2014-02-27
Metallization Mixtures And Electronic Devices App 20140034370 - KOLICS; Artur ; et al.	2014-02-06
Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers App 20140037982 - Ivanov; Igor C. ; et al.	2014-02-06
Solutions and methods for metal deposition Grant 8,632,628 - Kolics January 21, 2	2014-01-21
Porous dielectrics K value restoration by thermal treatment and or solvent treatment Grant 8,603,913 - Li , et al. December 10, 2	2013-12-10
Post-deposition Cleaning Methods And Formulations For Substrates With Cap Layers App 20130323410 - KOLICS; Artur ; et al.	2013-12-05
Method for strengthening adhesion between dielectric layers formed adjacent to metal layers Grant 8,586,133 - Ivanov , et al. November 19, 2	2013-11-19
Electroless Copper Alloy Capping App 20130240484 - KOLICS; Artur	2013-09-19
Electroless Gap Fill App 20130244423 - KOLICS; Artur	2013-09-19
Methods And Layers For Metallization App 20130228923 - KOLICS; ARTUR ; et al.	2013-09-05
Methods And Materials For Anchoring Gapfill Metals App 20130224511 - KOLICS; ARTUR	2013-08-29
Metallization processes, mixtures, and electronic devices Grant 8,518,826 - Kolics , et al. August 27, 2	2013-08-27
Methods, devices, and materials for metallization Grant 8,518,815 - Kolics , et al. August 27, 2	2013-08-27
Electroless Deposition Solutions And Process Control App 20130078808 - Kolics; Artur	2013-03-28
Post-deposition cleaning methods and formulations for substrates with cap layers Grant 8,404,626 - Kolics , et al. March 26, 2	2013-03-26
Electroless deposition solutions and process control Grant 8,328,919 - Kolics December 11, 2	2012-12-11
Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers App 20120282483 - Ivanov; Igor C. ; et al.	2012-11-08
Apparatus and Method for Electroless Deposition of Materials on Semiconductor Substrates App 20120213914 - Ivanov; Igor C. ; et al.	2012-08-23
Solutions And Methods For Metal Deposition App 20120104331 - KOLICS; Artur	2012-05-03
Apparatus and method for electroless deposition of materials on semiconductor substrates Grant 8,128,987 - Ivanov , et al. March 6, 2	2012-03-06
Metallization Processes, Mixtures, And Electronic Devices App 20120013008 - Kolics; Artur ; et al.	2012-01-19
Methods, Devices, And Materials For Metallization App 20120007239 - Kolics; Artur ; et al.	2012-01-12
Post Deposition Wafer Cleaning Formulation App 20110152151 - Kolics; Artur	2011-06-23
Integrated Tool Sets And Process To Keep Substrate Surface Wet During Plating And Clean In Fabrication Of Advanced Nano-electronic Devices App 20110143553 - Wang; Yaxin ; et al.	2011-06-16
Electroless Deposition System App 20110135824 - Rulkens; Ron ; et al.	2011-06-09
Electroless deposition system Grant 7,913,644 - Rulkens , et al. March 29, 2	2011-03-29
Method for strengthening adhesion between dielectric layers formed adjacent to metal layers Grant 7,883,739 - Ivanov , et al. February 8, 2	2011-02-08
Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers App 20110014489 - Ivanov; Igor C. ; et al.	2011-01-20
Electroless Deposition Solutions And Process Control App 20110014361 - Kolics; Artur	2011-01-20
Electroless deposition chemical system limiting strongly adsorbed species Grant 7,780,772 - Kolics , et al. August 24, 2	2010-08-24
Semiconductor system with surface modification Grant 7,772,128 - Kolics , et al. August 10, 2	2010-08-10
Electroless Deposition Chemical System Limiting Strongly Adsorbed Species App 20090288594 - Kolics; Artur ; et al.	2009-11-26
Electroless Deposition System App 20090288593 - Rulkens; Ron ; et al.	2009-11-26
Processes And Solutions For Substrate Cleaning And Electroless Deposition App 20090246359 - KOLICS; Artur ; et al.	2009-10-01
Post-deposition Cleaning Methods And Formulations For Substrates With Cap Layers App 20090162537 - KOLICS; Artur ; et al.	2009-06-25
Activation Solution For Electroless Plating On Dielectric Layers App 20090162681 - KOLICS; Artur	2009-06-25
Method And Apparatus For Plating Solution Analysis And Control App 20090157229 - Rulkens; Ron ; et al.	2009-06-18
Cleaning Solution Formulations For Substrates App 20090072190 - KOLICS; Artur	2009-03-19
Cleaning Solution Formulations For Substrates App 20090065735 - KOLICS; Artur ; et al.	2009-03-12
Semiconductor System With Surface Modification App 20070287277 - Kolics; Artur ; et al.	2007-12-13
Nano-electrode-array For Integrated Circuit Interconnects App 20070284746 - Lopatin; Sergey D. ; et al.	2007-12-13
Nano-electrode-array for integrated circuit interconnects Grant 7,226,856 - Lopatin , et al. June 5, 2	2007-06-05
Apparatus and method for electroless deposition of materials on semiconductor substrates App 20050221015 - Ivanov, Igor C. ; et al.	2005-10-06
Apparatus and method for electroless deposition of materials on semiconductor substrates Grant 6,913,651 - Ivanov , et al. July 5, 2	2005-07-05
Solution composition and method for electroless deposition of coatings free of alkali metals Grant 6,911,067 - Kolics , et al. June 28, 2	2005-06-28
Temperature-controlled substrate holder for processing in fluids Grant 6,908,512 - Ivanov , et al. June 21, 2	2005-06-21
Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper Grant 6,902,605 - Kolics , et al. June 7, 2	2005-06-07
Temperature control sequence of electroless plating baths Grant 6,875,691 - Li , et al. April 5, 2	2005-04-05
Method and apparatus for electroless deposition with temperature-controlled chuck Grant 6,846,519 - Ivanov , et al. January 25, 2	2005-01-25
Methods for making and processing diffusion barrier layers App 20040253826 - Ivanov, Igor C. ; et al.	2004-12-16
Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation Grant 6,794,288 - Kolics , et al. September 21, 2	2004-09-21
Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper App 20040175509 - Kolics, Artur ; et al.	2004-09-09
Solution composition and method for electroless deposition of coatings free of alkali metals App 20040134375 - Kolics, Artur ; et al.	2004-07-15
Temperature control sequence of electroless plating baths App 20030235983 - Li, Nanhai ; et al.	2003-12-25
Apparatus and method for electroless deposition of materials on semiconductor substrates App 20030181040 - Ivanov, Igor ; et al.	2003-09-25

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