Kolc; Ronald F.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kolc; Ronald F..The latest application filed is for "fabrication and structures of circuit modules with flexible interconnect layers".
- Kolc; Ronald F. - Cherry Hill NJ
| Patent | Date |
|---|---|
| Fabrication and structures of circuit modules with flexible interconnect layers Grant 5,527,741 - Cole , et al. June 18, 1 | 1996-06-18 |
| Nozzle for dispensing viscous fluid Grant 4,291,642 - Kolc September 29, 1 | 1981-09-29 |
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