Kolan; Ravi Kanth
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kolan; Ravi Kanth.The latest application filed is for "packaging structural member".
- Kolan; Ravi Kanth - Singapore SG
| Patent | Date |
|---|---|
| Packaging structural member Grant 9,704,726 - Toh , et al. July 11, 2 | 2017-07-11 |
| Packaging Structural Member App 20160005629 - TOH; Chin Hock ; et al. | 2016-01-07 |
| Packaging structural member Grant 9,142,487 - Toh , et al. September 22, 2 | 2015-09-22 |
| Interposer for semiconductor package Grant 8,772,921 - Toh , et al. July 8, 2 | 2014-07-08 |
| Through silicon via dies and packages Grant 8,741,762 - Liu , et al. June 3, 2 | 2014-06-03 |
| Through Silicon Via Dies And Packages App 20140045301 - LIU; Hao ; et al. | 2014-02-13 |
| Through silicon via dies and packages Grant 8,586,465 - Liu , et al. November 19, 2 | 2013-11-19 |
| Packaging Structural Member App 20130119560 - TOH; Chin Hock ; et al. | 2013-05-16 |
| Vented die and package Grant 8,426,246 - Toh , et al. April 23, 2 | 2013-04-23 |
| Mold design and semiconductor package Grant 8,399,985 - Kolan , et al. March 19, 2 | 2013-03-19 |
| Packaging structural member Grant 8,384,203 - Toh , et al. February 26, 2 | 2013-02-26 |
| Vented Die And Package App 20120149150 - TOH; Chin Hock ; et al. | 2012-06-14 |
| Interposer For Semiconductor Package App 20120104628 - TOH; Chin Hock ; et al. | 2012-05-03 |
| Vented die and package Grant 8,143,719 - Toh , et al. March 27, 2 | 2012-03-27 |
| Interposer for semiconductor package Grant 8,115,292 - Toh , et al. February 14, 2 | 2012-02-14 |
| Mold Design And Semiconductor Package App 20120018869 - KOLAN; Ravi Kanth ; et al. | 2012-01-26 |
| Mold design and semiconductor package Grant 8,030,761 - Kolan , et al. October 4, 2 | 2011-10-04 |
| Stacked die semiconductor package and method of assembly Grant 7,883,938 - Kolan , et al. February 8, 2 | 2011-02-08 |
| Structurally-enhanced integrated circuit package and method of manufacture Grant 7,830,006 - Kolan , et al. November 9, 2 | 2010-11-09 |
| Interposer For Semiconductor Package App 20100109142 - Toh; Chin Hock ; et al. | 2010-05-06 |
| Semiconductor Package And Method Of Making The Same App 20100109169 - KOLAN; Ravi Kanth ; et al. | 2010-05-06 |
| Packaging Structural Member App 20100013081 - TOH; Chin Hock ; et al. | 2010-01-21 |
| Structurally-enhanced integrated circuit package and method of manufacture App 20090072391 - Kolan; Ravi Kanth ; et al. | 2009-03-19 |
| Stacked die semiconductor package and method of assembly App 20090004777 - Kolan; Ravi Kanth ; et al. | 2009-01-01 |
| Vented Die And Package App 20080303031 - TOH; Chin Hock ; et al. | 2008-12-11 |
| Through Silicon Via Dies And Packages App 20080303163 - LIU; Hao ; et al. | 2008-12-11 |
| Mold Design And Semiconductor Package App 20080290505 - KOLAN; Ravi Kanth ; et al. | 2008-11-27 |
| Chip Scale Package and Method of Assembling the Same App 20080290509 - Tan; Hien Boon ; et al. | 2008-11-27 |
| Method Of Assembling A Silicon Stack Semiconductor Package App 20080293186 - Hao; Liu ; et al. | 2008-11-27 |
| Thermally enhanced semiconductor package and method of producing the same App 20070164425 - Kolan; Ravi Kanth ; et al. | 2007-07-19 |
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