Kolagunta; Venkat

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kolagunta; Venkat.The latest application filed is for "integrated assist features for epitaxial growth bulk tiles with compensation".

Company Profile

0.6.6

Kolagunta; Venkat - Austin TX US
Kolagunta, Venkat - Auston TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated assist features for epitaxial growth Grant 8,741,743 - Zia , et al. June 3, 2	2014-06-03
Integrated assist features for epitaxial growth bulk tiles with compensation Grant 7,565,639 - Zia , et al. July 21, 2	2009-07-21
Integrated assist features for epitaxial growth bulk/SOI hybrid tiles with compensation Grant 7,470,624 - Zia , et al. December 30, 2	2008-12-30
Integrated assist features for epitaxial growth bulk/SOI hybrid tiles with compensation App 20080168418 - Zia; Omar ; et al.	2008-07-10
Integrated assist features for epitaxial growth App 20080166859 - Zia; Omar ; et al.	2008-07-10
Integrated assist features for epitaxial growth bulk tiles with compensation App 20080168417 - Zia; Omar ; et al.	2008-07-10
Method of forming a semiconductor device with decreased undercutting of semiconductor material Grant 7,323,373 - Mathew , et al. January 29, 2	2008-01-29
Method of forming a semiconductor device with decreased undercutting of semiconductor material App 20070172996 - Mathew; Leo ; et al.	2007-07-26
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process App 20020151167 - Farkas, Janos ; et al.	2002-10-17
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process Grant 6,444,569 - Farkas , et al. September 3, 2	2002-09-03
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process App 20010027083 - Farkas, Janos ; et al.	2001-10-04

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