Kokura; Satoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kokura; Satoshi.The latest application filed is for "bonded type piezoelectric apparatus, method for manufacturing the same and bonded type piezoelectric element".

Company Profile

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Kokura; Satoshi - Hitachiohta JP
Kokura; Satoshi - Ohta JP
Kokura; Satoshi - Hitachiota JP
Kokura; Satoshi - Hitachi JA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bonded type piezoelectric apparatus, method for manufacturing the same and bonded type piezoelectric element Grant 5,325,012 - Sato , et al. June 28, 1	1994-06-28
Method of joining an insulated wire to a conductive terminal Grant 4,902,867 - Haramaki , et al. February 20, 1	1990-02-20
Diffusion bonding method using a high energy beam Grant 4,691,856 - Haramaki , et al. September 8, 1	1987-09-08
SiC sintered body having metallized layer and production method thereof Grant 4,663,649 - Suzuki , et al. May 5, 1	1987-05-05
Method of brazing an aluminum heat exchanger Grant 4,645,119 - Haramaki , et al. February 24, 1	1987-02-24
Two electrode welding with different currents supplied to the electrodes Grant 4,436,982 - Kokura , et al. March 13, 1	1984-03-13
Method of electrode current control in welding apparatus having a plurality of electrodes Grant 4,396,823 - Nihei , et al. August 2, 1	1983-08-02
Method and apparatus for automatically controlling arc welding Grant 4,280,137 - Ashida , et al. July 21, 1	1981-07-21
Electroslag Welding Method Grant 3,825,716 - Kokura , et al. July 23, 1	1974-07-23

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