loadpatents
Patent applications and USPTO patent grants for Kokubunji; Hiroshi.The latest application filed is for "mounting structure for heat exchanger and duplex heat exchanger".
Patent | Date |
---|---|
Heat exchanger Grant 6,938,675 - Kokubunji , et al. September 6, 2 | 2005-09-06 |
Mounting structure for heat exchanger and duplex heat exchanger Grant 6,705,387 - Kokubunji , et al. March 16, 2 | 2004-03-16 |
Compound heat exhanger having cooling fins introducing different heat exhanging performances within heat exchanging core portion Grant 6,561,264 - Ozaki , et al. May 13, 2 | 2003-05-13 |
Mounting structure for heat exchanger and duplex heat exchanger App 20020056541 - Kokubunji, Hiroshi ;   et al. | 2002-05-16 |
Heat exchanger App 20020040776 - Kokubunji, Hiroshi ;   et al. | 2002-04-11 |
Compound heat exchanger having cooling fins introducing different heat exchanging performances within heat exchanging core portion App 20010022220 - Ozaki, Tatsuo ;   et al. | 2001-09-20 |
Tube App 20010022221 - Yamauchi, Takumi ;   et al. | 2001-09-20 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.