Kokaku; Hiroyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kokaku; Hiroyoshi.The latest application filed is for "circuit tape having adhesive film semiconductor device and a method for manufacturing the same".

Company Profile

0.19.9

Kokaku; Hiroyoshi - Hitachi JP
Kokaku, Hiroyoshi - Hitachi-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device Grant 7,217,992 - Ogino , et al. May 15, 2	2007-05-15
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same Grant 7,202,570 - Nagai , et al. April 10, 2	2007-04-10
Wiring tape for semiconductor device including a buffer layer having interconnected foams Grant 7,038,325 - Ogino , et al. May 2, 2	2006-05-02
Semiconductor device Grant 6,919,622 - Murakami , et al. July 19, 2	2005-07-19
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device Grant 6,888,230 - Ogino , et al. May 3, 2	2005-05-03
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same Grant 6,878,448 - Ishii , et al. April 12, 2	2005-04-12
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same App 20040224149 - Nagai, Akira ; et al.	2004-11-11
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device App 20040217453 - Ogino, Masahiko ; et al.	2004-11-04
Wiring tape for semiconductor device including a buffer layer having interconnected foams App 20040195702 - Ogino, Masahiko ; et al.	2004-10-07
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same Grant 6,791,194 - Nagai , et al. September 14, 2	2004-09-14
Semiconductor device App 20040155323 - Murakami, Gen ; et al.	2004-08-12
Semiconductor device Grant 6,720,208 - Murakami , et al. April 13, 2	2004-04-13
Semiconductor device App 20030127712 - Murakami, Gen ; et al.	2003-07-10
Semiconductor device and wiring tape for semiconductor device App 20020158343 - Ogino, Masahiko ; et al.	2002-10-31
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same App 20020160185 - Nagai, Akira ; et al.	2002-10-31
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same App 20020146565 - Ishll, Toshiaki ; et al.	2002-10-10
Semiconductor device App 20010008302 - Murakami, Gen ; et al.	2001-07-19
Laminate and multilayer printed circuit board Grant 6,114,005 - Nagai , et al. September 5, 2	2000-09-05
Semiconductor device having all outer leads extending from one side of a resin member Grant 6,100,580 - Murakami , et al. August 8, 2	2000-08-08
Resin sealed semiconductor devices and a process for manufacturing the same Grant 6,097,100 - Eguchi , et al. August 1, 2	2000-08-01
Semiconductor device Grant 6,081,023 - Murakami , et al. June 27, 2	2000-06-27
Semiconductor device chip on lead and lead on chip manufacturing Grant 6,069,029 - Murakami , et al. May 30, 2	2000-05-30
Laminate and multilayer printed circuit board Grant 5,677,045 - Nagai , et al. October 14, 1	1997-10-14
Semiconductor device Grant 5,612,569 - Murakami , et al. March 18, 1	1997-03-18
Semiconductor device Grant 5,530,286 - Murakami , et al. June 25, 1	1996-06-25
Semiconductor device Grant 5,358,904 - Murakami , et al. * October 25, 1	1994-10-25
Resin composition for encapsulating of semiconductor and semiconductor apparatus using of the same Grant 5,225,499 - Kokaku , et al. July 6, 1	1993-07-06
Semiconductor device Grant 5,068,712 - Murakami , et al. November 26, 1	1991-11-26

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