Kojima; Toshifumi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kojima; Toshifumi.The latest application filed is for "method and system for social gamification of commercial offers".
- Kojima; Toshifumi - Earnest Hills NY
- Kojima; Toshifumi - Aichi JP
- Kojima; Toshifumi - Komaki JP
- Kojima, Toshifumi - Komaki-shi JP
- Kojima, Toshifumi - Nagoya-shi JP
- Kojima; Toshifumi - Tokyo JP
| Patent | Date |
|---|---|
| Method and System for Social Gamification of Commercial Offers App 20150310471 - Kotorov; Radoslav P. ; et al. | 2015-10-29 |
| Optical module, optical module substrate and optical coupling structure Grant 7,484,897 - Ono , et al. February 3, 2 | 2009-02-03 |
| Filling material, multilayer wiring board, and process of producing multilayer wiring board Grant 7,438,969 - Kojima , et al. October 21, 2 | 2008-10-21 |
| Optical module, optical module substrate and optical coupling structure Grant 7,404,680 - Ono , et al. July 29, 2 | 2008-07-29 |
| Optical Module, Optical Module Substrate And Optical Coupling Structure App 20080063342 - ONO; Masaki ; et al. | 2008-03-13 |
| Substrate assembly for supporting optical component and method of producing the same Grant 7,221,829 - Oono , et al. May 22, 2 | 2007-05-22 |
| Multilayer wiring board Grant 7,183,497 - Kojima , et al. February 27, 2 | 2007-02-27 |
| Optical device mounted substrate assembly Grant 7,150,569 - Oono , et al. December 19, 2 | 2006-12-19 |
| Optical module, optical module substrate and optical coupling structure App 20050265671 - Ono, Masaki ; et al. | 2005-12-01 |
| Multilayer wiring board App 20050126818 - Kojima, Toshifumi ; et al. | 2005-06-16 |
| Optical device mounted substrate assembly App 20050105860 - Oono, Takeshi ; et al. | 2005-05-19 |
| Wiring board Grant 6,876,091 - Takeuchi , et al. April 5, 2 | 2005-04-05 |
| Embedding resin and wiring substrate using the same Grant 6,822,170 - Takeuchi , et al. November 23, 2 | 2004-11-23 |
| Substrate assembly for supporting optical component and method of producing the same App 20040184737 - Oono, Takeshi ; et al. | 2004-09-23 |
| Wiring substrate using embedding resin Grant 6,770,965 - Takeuchi , et al. August 3, 2 | 2004-08-03 |
| Embedding resin, wiring substrate using same and process for producing wiring substrate using same Grant 6,740,411 - Kojima , et al. May 25, 2 | 2004-05-25 |
| Embedding resin Grant 6,680,123 - Takeuchi , et al. January 20, 2 | 2004-01-20 |
| Filling material, multilayer wiring board, and process of producing multilayer wiring board App 20040009335 - Kojima, Toshifumi ; et al. | 2004-01-15 |
| Embedding resin and wiring substrate using the same App 20030047809 - Takeuchi, Hiroki ; et al. | 2003-03-13 |
| Wiring circuit board and method for producing same Grant 6,512,182 - Takeuchi , et al. January 28, 2 | 2003-01-28 |
| Wiring circuit board and method for producing same App 20020185303 - Takeuchi, Hiroki ; et al. | 2002-12-12 |
| Embedding resin App 20020147263 - Takeuchi, Hiroki ; et al. | 2002-10-10 |
| Embedding resin App 20020147264 - Takeuchi, Hiroki ; et al. | 2002-10-10 |
| Wiring board and method for fabricating the same App 20020132094 - Takeuchi, Hiroki ; et al. | 2002-09-19 |
| Wiring board App 20020132096 - Takeuchi, Hiroki ; et al. | 2002-09-19 |
| Embedding resin and wiring substrate using the same App 20020127418 - Takeuchi, Hiroki ; et al. | 2002-09-12 |
| Paste for through-hole filling and printed wiring board using the same Grant 6,193,910 - Ikai , et al. February 27, 2 | 2001-02-27 |
| Method of liquid phase diffusion bonding of metal bodies Grant 4,988,035 - Ueno , et al. January 29, 1 | 1991-01-29 |
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