loadpatents
name:-0.012395858764648
name:-0.013330936431885
name:-0.0015280246734619
Kojima; Shunichiro Patent Filings

Kojima; Shunichiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kojima; Shunichiro.The latest application filed is for "substrate holding apparatus".

Company Profile
0.11.7
  • Kojima; Shunichiro - Yokohama JP
  • KOJIMA; Shunichiro - Yokohama-shi JP
  • Kojima; Shunichiro - Kanagawa JP
  • Kojima; Shunichiro - Tokyo JP
  • Kojima; Shunichiro - Fujisawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Substrate holding apparatus
Grant 7,850,509 - Togawa , et al. December 14, 2
2010-12-14
Substrate holding apparatus
App 20090061748 - TOGAWA; Tetsuji ;   et al.
2009-03-05
Substrate holding apparatus
Grant 7,491,117 - Togawa , et al. February 17, 2
2009-02-17
Substrate polishing machine
Grant 7,156,725 - Togawa , et al. January 2, 2
2007-01-02
Substrate holding apparatus
App 20060234609 - Togawa; Tetsuji ;   et al.
2006-10-19
Substrate holding apparatus
Grant 7,083,507 - Togawa , et al. August 1, 2
2006-08-01
Substrate holding apparatus
App 20050118935 - Togawa, Tetsuji ;   et al.
2005-06-02
Dressing apparatus and polishing apparatus
Grant 6,899,604 - Togawa , et al. May 31, 2
2005-05-31
Polishing apparatus and dressing method for polishing tool
Grant 6,899,592 - Kojima , et al. May 31, 2
2005-05-31
Substrate holding apparatus
Grant 6,852,019 - Togawa , et al. February 8, 2
2005-02-08
Substrate polishing machine
App 20040209560 - Togawa, Tetsuji ;   et al.
2004-10-21
Method for polishing angular substrates
Grant 6,790,129 - Moriya , et al. September 14, 2
2004-09-14
Dressing apparatus and polishing apparatus
App 20030148707 - Togawa, Tetsuji ;   et al.
2003-08-07
Method for polishing angular substrates
App 20030036340 - Moriya, Jiro ;   et al.
2003-02-20
Workpiece polishing apparatus comprising a fluid pressure bag provided between a pressing surface and the workpiece and method of use thereof
Grant 6,435,949 - Katsuoka , et al. August 20, 2
2002-08-20
Substrate holding apparatus
App 20020042246 - Togawa, Tetsuji ;   et al.
2002-04-11
Polishing device
Grant 6,293,858 - Kimura , et al. September 25, 2
2001-09-25
Polishing apparatus
Grant 6,241,592 - Togawa , et al. June 5, 2
2001-06-05

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