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Patent applications and USPTO patent grants for Kojima; Shunichiro.The latest application filed is for "substrate holding apparatus".
Patent | Date |
---|---|
Substrate holding apparatus Grant 7,850,509 - Togawa , et al. December 14, 2 | 2010-12-14 |
Substrate holding apparatus App 20090061748 - TOGAWA; Tetsuji ;   et al. | 2009-03-05 |
Substrate holding apparatus Grant 7,491,117 - Togawa , et al. February 17, 2 | 2009-02-17 |
Substrate polishing machine Grant 7,156,725 - Togawa , et al. January 2, 2 | 2007-01-02 |
Substrate holding apparatus App 20060234609 - Togawa; Tetsuji ;   et al. | 2006-10-19 |
Substrate holding apparatus Grant 7,083,507 - Togawa , et al. August 1, 2 | 2006-08-01 |
Substrate holding apparatus App 20050118935 - Togawa, Tetsuji ;   et al. | 2005-06-02 |
Dressing apparatus and polishing apparatus Grant 6,899,604 - Togawa , et al. May 31, 2 | 2005-05-31 |
Polishing apparatus and dressing method for polishing tool Grant 6,899,592 - Kojima , et al. May 31, 2 | 2005-05-31 |
Substrate holding apparatus Grant 6,852,019 - Togawa , et al. February 8, 2 | 2005-02-08 |
Substrate polishing machine App 20040209560 - Togawa, Tetsuji ;   et al. | 2004-10-21 |
Method for polishing angular substrates Grant 6,790,129 - Moriya , et al. September 14, 2 | 2004-09-14 |
Dressing apparatus and polishing apparatus App 20030148707 - Togawa, Tetsuji ;   et al. | 2003-08-07 |
Method for polishing angular substrates App 20030036340 - Moriya, Jiro ;   et al. | 2003-02-20 |
Workpiece polishing apparatus comprising a fluid pressure bag provided between a pressing surface and the workpiece and method of use thereof Grant 6,435,949 - Katsuoka , et al. August 20, 2 | 2002-08-20 |
Substrate holding apparatus App 20020042246 - Togawa, Tetsuji ;   et al. | 2002-04-11 |
Polishing device Grant 6,293,858 - Kimura , et al. September 25, 2 | 2001-09-25 |
Polishing apparatus Grant 6,241,592 - Togawa , et al. June 5, 2 | 2001-06-05 |
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