Kojima; Kazuyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kojima; Kazuyoshi.The latest application filed is for "circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material".

Company Profile

0.18.17

Kojima; Kazuyoshi - Chikusei JP
Kojima; Kazuyoshi - Tsukuba JP
Kojima; Kazuyoshi - Ibaraki JP
Kojima; Kazuyoshi - Chikusei-shi JP
Kojima; Kazuyoshi - Tokyo JP
Kojima; Kazuyoshi - Simodate JP
Kojima; Kazuyoshi - Hyogo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same Grant 8,501,045 - Arifuku , et al. August 6, 2	2013-08-06
Adhesive for bonding circuit members, circuit board and process for its production Grant 8,273,457 - Watanabe , et al. September 25, 2	2012-09-25
Adhesive for bonding circuit members, circuit board and process for its production Grant 8,273,458 - Watanabe , et al. September 25, 2	2012-09-25
Adhesive for bonding circuit members, circuit board and process for its production Grant 8,252,419 - Watanabe , et al. August 28, 2	2012-08-28
Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same Grant 8,202,622 - Arifuku , et al. June 19, 2	2012-06-19
Circuit connecting method Grant 8,132,319 - Arifuku , et al. March 13, 2	2012-03-13
Circuit Connection Material, And Connection Structure Of Circuit Member And Connection Method Of Circuit Member Using The Circuit Connection Material App 20110267791 - Tomisaka; Katsuhiko ; et al.	2011-11-03
Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same Grant 8,043,709 - Arifuku , et al. October 25, 2	2011-10-25
Adhesive For Bonding Circuit Members, Circuit Board And Process For Its Production App 20110247867 - WATANABE; Itsuo ; et al.	2011-10-13
Adhesive For Bonding Circuit Members, Circuit Board And Process For Its Production App 20110247873 - WATANABE; Itsuo ; et al.	2011-10-13
Adhesive For Bonding Circuit Members, Circuit Board And Process For Its Production App 20110247874 - WATANABE; Itsuo ; et al.	2011-10-13
Circuit Connection Material, Film-form Circuit Connecting Material Using The Same, Circuit Member Connecting Structure, And Method Of Manufacturing The Same App 20110247757 - ARIFUKU; Motohiro ; et al.	2011-10-13
Circuit Connecting Material, Film-form Circuit Connecting Material Using The Same, Circuit Member Connecting Structure And Method Of Manufacturing The Same App 20110247870 - Arifuku; Motohiro ; et al.	2011-10-13
Adhesive for bonding circuit members, circuit board and process for its production Grant 7,879,445 - Watanabe , et al. February 1, 2	2011-02-01
Circuit Connecting Material, Connection Structure And Method For Producing The Same App 20100307805 - Nakazawa; Takashi ; et al.	2010-12-09
Circuit-connecting Material And Circuit Terminal Connection Structure App 20100277884 - Arifuku; Motohiro ; et al.	2010-11-04
Circuit Connecting Method App 20100263208 - Arifuku; Motohiro ; et al.	2010-10-21
Filmy Adhesive For Circuit Connection App 20100140556 - Kojima; Kazuyoshi ; et al.	2010-06-10
Circuit-connecting Material, And Connection Structure For Circuit Member App 20100139947 - Kojima; Kazuyoshi ; et al.	2010-06-10
Circuit Connection Structure App 20100025097 - Kojima; Kazuyoshi ; et al.	2010-02-04
Circuit Connecting Material, Film-form Circuit Connecting Material Using The Same, Circuit Member Connecting Structure And Method Of Manufacturing The Same App 20090321116 - Arifuku; Motohiro ; et al.	2009-12-31
Adhesive For Bonding Circuit Members, Circuit Board And Process For Its Production App 20090314533 - Watanabe; Itsuo ; et al.	2009-12-24
Internet communication system, internet communication method, session management server, radio communication device, communication relay server, and program Grant 7,298,733 - Sakai , et al. November 20, 2	2007-11-20
Adhesive for bonding circuit members, circuit board, and method of producing the same Grant 7,247,381 - Watanabe , et al. July 24, 2	2007-07-24
Adhesive for bonding circuit members, circuit board and process for its production App 20070137887 - Watanabe; Itsuo ; et al.	2007-06-21
Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same App 20060100314 - Arifuku; Motohiro ; et al.	2006-05-11
Internet communication system, internet communication method, session management server, radio communication device, communication relay server, and program App 20040243712 - Sakai, Hiroaki ; et al.	2004-12-02
Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet Grant 6,338,195 - Tsukagoshi , et al. January 15, 2	2002-01-15
Method of production of semiconductor device Grant 6,223,429 - Kaneda , et al. May 1, 2	2001-05-01
Electronic component parts device Grant 6,184,577 - Takemura , et al. February 6, 2	2001-02-06
Thin film forming apparatus using laser Grant 6,110,291 - Haruta , et al. August 29, 2	2000-08-29
Thin film forming apparatus using laser Grant 6,033,741 - Haruta , et al. March 7, 2	2000-03-07
Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet Grant 6,034,331 - Tsukagoshi , et al. March 7, 2	2000-03-07
Thin film forming apparatus using laser Grant 5,622,567 - Kojima , et al. April 22, 1	1997-04-22

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