Kojima; Haruo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kojima; Haruo.The latest application filed is for "grounding structure of high frequency circuit board".

Company Profile

0.19.14

Kojima; Haruo - Kawasaki JP
Kojima; Haruo - Kanagawa-ken N/A JP
Kojima; Haruo - Aizuwakamatsu JP
Kojima; Haruo - Kawasaki-City JP
Kojima; Haruo - Aizuwakamatsu-shi JP
Kojima; Haruo - Kawasaki-Shi JP
Kojima; Haruo - Toki-shi Gifu 509-5132 JP
Kojima; Haruo - Toki JP
Kojima; Haruo - Aichi JP
Kojima; Haruo - Yokohama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Grounding structure of high frequency circuit board Grant 11,252,814 - Asahi , et al. February 15, 2	2022-02-15
Grounding Structure Of High Frequency Circuit Board App 20200344874 - ASAHI; Yasuaki ; et al.	2020-10-29
Pulse electric power amplification apparatus Grant 8,581,664 - Kojima November 12, 2	2013-11-12
Pulse Electric Power Amplification Apparatus App 20120268209 - KOJIMA; Haruo	2012-10-25
Array antenna system and transmit/receive module thereof Grant 8,259,686 - Kanto , et al. September 4, 2	2012-09-04
Transmission and reception module Grant 8,223,080 - Kojima July 17, 2	2012-07-17
Transmission And Reception Module App 20110057860 - KOJIMA; Haruo	2011-03-10
Method of manufacturing a semiconductor using a rigid substrate Grant 7,781,259 - Nagahama , et al. August 24, 2	2010-08-24
Array Antenna System And Transmit/receive Module Thereof App 20090156138 - KANTO; Kazuhiro ; et al.	2009-06-18
Transmitting-receiving module of radar system Grant 7,436,353 - Kojima October 14, 2	2008-10-14
Semiconductor amplifier Grant 7,423,491 - Kojima September 9, 2	2008-09-09
Switching circuit using semiconductor switching element Grant 7,372,315 - Kojima May 13, 2	2008-05-13
Semiconductor Amplifier App 20070252650 - KOJIMA; Haruo	2007-11-01
Semiconductor amplifier Grant 7,262,668 - Kojima August 28, 2	2007-08-28
Transmitting-receiving module of radar system App 20070115170 - Kojima; Haruo	2007-05-24
Semiconductor device and method for manufacturing the same App 20070010046 - Nagahama; Youhei ; et al.	2007-01-11
Switching Circuit Using Semiconductor Switching Element App 20060267667 - KOJIMA; Haruo	2006-11-30
Method of manufacturing a semiconductor device using a rigid substrate including the vent-end edge portion of the substrate has a thickness smaller than the other portions of the substrate Grant 7,122,402 - Nagahama , et al. October 17, 2	2006-10-17
Power amplifier with pulse differentiating circuit Grant 7,123,089 - Kojima October 17, 2	2006-10-17
Transmitter-receiver module App 20060222061 - Kojima; Haruo	2006-10-05
Limiter circuit Grant 7,009,462 - Kojima March 7, 2	2006-03-07
Semiconductor amplifier App 20050275465 - Kojima, Haruo	2005-12-15
Amplifier App 20050104656 - Kojima, Haruo	2005-05-19
Method of manufacturing a semiconductor device using a rigid substrate App 20050070051 - Nagahama, Youhei ; et al.	2005-03-31
Limiter circuit App 20050024159 - Kojima, Haruo	2005-02-03
Microwave integrated circuit Grant 6,762,493 - Kojima , et al. July 13, 2	2004-07-13
Microwave integrated circuit App 20030183927 - Kojima, Haruo ; et al.	2003-10-02
Method for separating magnetic particles mixed in fluid, separating system, and separator Grant 6,383,397 - Kojima May 7, 2	2002-05-07
Resin molded semiconductor device and method of manufacturing semiconductor package Grant 6,166,433 - Takashima , et al. December 26, 2	2000-12-26
Placer gold mining method, placer gold mining boat used in this method, placer gold digging and separating method and system therefor, and placer gold separating method and system therefor Grant 6,138,833 - Matsufuji , et al. October 31, 2	2000-10-31
Method for treating metal surface with zinc phosphate Grant 5,244,512 - Kawasaki , et al. September 14, 1	1993-09-14
Method for producing a package for a semiconductor device Grant 4,710,250 - Kojima , et al. December 1, 1	1987-12-01

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