loadpatents
name:-0.0066449642181396
name:-0.0054700374603271
name:-0.0003972053527832
Koji; Yukichi Patent Filings

Koji; Yukichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Koji; Yukichi.The latest application filed is for "etching agent for copper or copper alloy".

Company Profile
0.7.7
  • Koji; Yukichi - Tokyo JP
  • Koji; Yukichi - Shiga-ken JP
  • Koji; Yukichi - Otsu-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Etching solution for copper or copper alloy
Grant 10,570,522 - Yoshida , et al. Feb
2020-02-25
Etching agent for copper or copper alloy
Grant 9,790,600 - Kojima , et al. October 17, 2
2017-10-17
Cleaning agent for semiconductor provided with metal wiring
Grant 9,476,019 - Nakanishi , et al. October 25, 2
2016-10-25
Etching Agent For Copper Or Copper Alloy
App 20160053383 - KOJIMA; Tsutomu ;   et al.
2016-02-25
Etching agent for copper or copper alloy
Grant 9,175,404 - Kojima , et al. November 3, 2
2015-11-03
Cleaning Agent For Semiconductor Provided With Metal Wiring
App 20150259632 - NAKANISHI; Mutsumi ;   et al.
2015-09-17
Cleaning agent for semiconductor provided with metal wiring
Grant 9,045,717 - Nakanishi , et al. June 2, 2
2015-06-02
Etching Agent For Copper Or Copper Alloy
App 20140238953 - Kojima; Tsutomu ;   et al.
2014-08-28
Etching Solution For Copper Or Copper Alloy
App 20130270217 - Yoshida; Yutaka ;   et al.
2013-10-17
Cleaning Agent For Semiconductor Provided With Metal Wiring
App 20130203643 - Nakanishi; Mutsumi ;   et al.
2013-08-08

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