loadpatents
name:-0.031814813613892
name:-0.037848949432373
name:-0.0062620639801025
Koizumi; Masahiro Patent Filings

Koizumi; Masahiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Koizumi; Masahiro.The latest application filed is for "hydraulic hammering device".

Company Profile
5.36.28
  • Koizumi; Masahiro - Gunma JP
  • Koizumi; Masahiro - Takasaki JP
  • Koizumi; Masahiro - Hiroshima JP
  • Koizumi; Masahiro - Takasaki-shi Gunma
  • KOIZUMI; Masahiro - Hiroshima-shi JP
  • Koizumi; Masahiro - Yokohama JP
  • Koizumi; Masahiro - Yokohama-shi JP
  • Koizumi; Masahiro - Hitachi JP
  • Koizumi; Masahiro - Shinagawa-ku JP
  • KOIZUMI; Masahiro - Hitachi-shi JP
  • Koizumi; Masahiro - Gunman-Ken JP
  • Koizumi; Masahiro - Kumamoto JP
  • Koizumi; Masahiro - Kamoto-gun JP
  • Koizumi; Masahiro - Honolulu HI
  • Koizumi, Masahiro - Obu-shi JP
  • Koizumi; Masahiro - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Hydraulic hammering device
Grant 11,207,769 - Koizumi December 28, 2
2021-12-28
Two-piston hydraulic striking device
Grant 11,072,977 - Koizumi , et al. July 27, 2
2021-07-27
Hydraulic hammering device
Grant 11,052,524 - Koizumi July 6, 2
2021-07-06
Hydraulic hammering device
Grant 11,034,010 - Kaneko , et al. June 15, 2
2021-06-15
Hydraulic Hammering Device
App 20200391368 - Koizumi; Masahiro
2020-12-17
Accessory drive device for engine
Grant 10,865,857 - Iwagami , et al. December 15, 2
2020-12-15
Two-Piston Hydraulic Striking Device
App 20200181978 - Koizumi; Masahiro ;   et al.
2020-06-11
Hydraulic hammering device
Grant 10,493,610 - Koizumi , et al. De
2019-12-03
Hydraulic Hammering Device
App 20190210205 - Kaneko; Tsutomu ;   et al.
2019-07-11
Accessory Drive Device For Engine
App 20180266312 - IWAGAMI; Takeyoshi ;   et al.
2018-09-20
Hydraulic Hammering Device
App 20180207782 - Koizumi; Masahiro
2018-07-26
Piston structure for engine
Grant 9,926,998 - Kanda , et al. March 27, 2
2018-03-27
Learning assistance server, learning assistance system, and learning assistance program
Grant 9,672,752 - Obae , et al. June 6, 2
2017-06-06
Piston Structure For Engine
App 20150219181 - Kanda; Yasunori ;   et al.
2015-08-06
Learning Assistance Server, Learning Assistance System, And Learning Assistance Program
App 20150079576 - Obae; Takahiro ;   et al.
2015-03-19
Mosfet package
Grant 8,816,411 - Kajiwara , et al. August 26, 2
2014-08-26
Retainer assembling apparatus and retainer assembling method
Grant 8,793,851 - Shiga , et al. August 5, 2
2014-08-05
Semiconductor Device
App 20130264696 - KAJIWARA; Ryoichi ;   et al.
2013-10-10
Mosfet package
Grant 8,455,986 - Kajiwara , et al. June 4, 2
2013-06-04
Retainer Assembling Apparatus And Retainer Assembling Method
App 20120285015 - SHIGA; Hiroyuki ;   et al.
2012-11-15
Semiconductor Device
App 20120217556 - Kajiwara; Ryoichi ;   et al.
2012-08-30
Semiconductor device
Grant 8,183,607 - Kajiwara , et al. May 22, 2
2012-05-22
Semiconductor Device
App 20110298020 - KAJIWARA; Ryoichi ;   et al.
2011-12-08
MOSFET package
Grant 7,985,991 - Kajiwara , et al. July 26, 2
2011-07-26
Drill rod, drill bit, and drilling tool
Grant 7,942,216 - Hisada , et al. May 17, 2
2011-05-17
Apparatus and a method of soldering a part to a board
Grant 7,649,159 - Matsuura , et al. January 19, 2
2010-01-19
Drill Rod, Drill Bit, And Drilling Tool
App 20090260892 - Hisada; Masaya ;   et al.
2009-10-22
Semiconductor Device
App 20080169537 - KAJIWARA; Ryoichi ;   et al.
2008-07-17
MOSFET package
Grant 7,400,002 - Kajiwara , et al. July 15, 2
2008-07-15
MOSFET package
Grant 7,394,146 - Kajiwara , et al. July 1, 2
2008-07-01
MOSFET package
Grant 7,342,267 - Kajiwara , et al. March 11, 2
2008-03-11
MOSFET package
Grant 7,332,757 - Kajiwara , et al. February 19, 2
2008-02-19
Semiconductor device
App 20070040248 - Kajiwara; Ryoichi ;   et al.
2007-02-22
Semiconductor device
App 20070040250 - Kajiwara; Ryoichi ;   et al.
2007-02-22
Semiconductor device
App 20070040249 - Kajiwara; Ryoichi ;   et al.
2007-02-22
Semiconductor device
App 20070029540 - Kajiwara; Ryoichi ;   et al.
2007-02-08
Apparatus and a method of soldering a part to a board
App 20070023486 - Matsuura; Masanari ;   et al.
2007-02-01
Circuit board
Grant 7,141,741 - Yamada , et al. November 28, 2
2006-11-28
Semiconductor device
App 20060197196 - Kajiwara; Ryoichi ;   et al.
2006-09-07
Semiconductor device
App 20060197200 - Kajiwara; Ryoichi ;   et al.
2006-09-07
Semiconductor device
App 20040217474 - Kajiwara, Ryoichi ;   et al.
2004-11-04
Flip chip assembly structure for semiconductor device and method of assembling therefor
Grant 6,798,072 - Kajiwara , et al. September 28, 2
2004-09-28
Semiconductor device and manufacturing method thereof
Grant 6,784,554 - Kajiwara , et al. August 31, 2
2004-08-31
Semiconductor device
Grant 6,774,466 - Kajiwara , et al. August 10, 2
2004-08-10
Semiconductor device
App 20040150082 - Kajiwara, Ryoichi ;   et al.
2004-08-05
Circuit board
App 20040056349 - Yamada, Kazuji ;   et al.
2004-03-25
Semiconductor device and manufacturing method thereof
App 20030127747 - Kajiwara, Ryoichi ;   et al.
2003-07-10
Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin material
Grant 6,569,764 - Hirashima , et al. May 27, 2
2003-05-27
Honeycomb structure
Grant 6,524,680 - Tanaka , et al. February 25, 2
2003-02-25
Semiconductor device
App 20030016502 - Yamada, Kazuji ;   et al.
2003-01-23
Semiconductor package and flip chip bonding method therein
App 20030001286 - Kajiwara, Ryoichi ;   et al.
2003-01-02
Flip chip assembly structure for semiconductor device and method of assembling therefor
App 20020056906 - Kajiwara, Ryoichi ;   et al.
2002-05-16
Colored translucent golf driver head
Grant D448,824 - Koizumi , et al. October 2, 2
2001-10-02
Fuel injection valve
App 20010010341 - Koizumi, Masahiro ;   et al.
2001-08-02
Semiconductor device having power semiconductor elements
Grant 5,956,231 - Yamada , et al. September 21, 1
1999-09-21
System for sub-data processor identifies the peripheral from supplied identification data and supplies data indicative of the kind of peripheral to main data processor
Grant 5,892,974 - Koizumi , et al. April 6, 1
1999-04-06
Ultrasonic bonding method and ultrasonic bonding apparatus
Grant 5,884,835 - Kajiwara , et al. March 23, 1
1999-03-23
System for peripheral identification obtained by calculation and manipulation data collecting for determining communication mode and collecting data from first terminal contacts
Grant 5,872,999 - Koizumi , et al. February 16, 1
1999-02-16
System and method for determining peripheral's communication mode over row of pins disposed in a socket connector
Grant 5,630,170 - Koizumi , et al. May 13, 1
1997-05-13
Semiconductor device and production process thereof, as well as wire bonding device used therefor
Grant 4,976,393 - Nakajima , et al. December 11, 1
1990-12-11
Semiconductor device
Grant 4,965,656 - Koubuchi , et al. October 23, 1
1990-10-23
Corrosion-resistant aluminum electronic material
Grant 4,912,544 - Onuki , et al. March 27, 1
1990-03-27

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