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Patent applications and USPTO patent grants for Koizumi; Masahiro.The latest application filed is for "hydraulic hammering device".
Patent | Date |
---|---|
Hydraulic hammering device Grant 11,207,769 - Koizumi December 28, 2 | 2021-12-28 |
Two-piston hydraulic striking device Grant 11,072,977 - Koizumi , et al. July 27, 2 | 2021-07-27 |
Hydraulic hammering device Grant 11,052,524 - Koizumi July 6, 2 | 2021-07-06 |
Hydraulic hammering device Grant 11,034,010 - Kaneko , et al. June 15, 2 | 2021-06-15 |
Hydraulic Hammering Device App 20200391368 - Koizumi; Masahiro | 2020-12-17 |
Accessory drive device for engine Grant 10,865,857 - Iwagami , et al. December 15, 2 | 2020-12-15 |
Two-Piston Hydraulic Striking Device App 20200181978 - Koizumi; Masahiro ;   et al. | 2020-06-11 |
Hydraulic hammering device Grant 10,493,610 - Koizumi , et al. De | 2019-12-03 |
Hydraulic Hammering Device App 20190210205 - Kaneko; Tsutomu ;   et al. | 2019-07-11 |
Accessory Drive Device For Engine App 20180266312 - IWAGAMI; Takeyoshi ;   et al. | 2018-09-20 |
Hydraulic Hammering Device App 20180207782 - Koizumi; Masahiro | 2018-07-26 |
Piston structure for engine Grant 9,926,998 - Kanda , et al. March 27, 2 | 2018-03-27 |
Learning assistance server, learning assistance system, and learning assistance program Grant 9,672,752 - Obae , et al. June 6, 2 | 2017-06-06 |
Piston Structure For Engine App 20150219181 - Kanda; Yasunori ;   et al. | 2015-08-06 |
Learning Assistance Server, Learning Assistance System, And Learning Assistance Program App 20150079576 - Obae; Takahiro ;   et al. | 2015-03-19 |
Mosfet package Grant 8,816,411 - Kajiwara , et al. August 26, 2 | 2014-08-26 |
Retainer assembling apparatus and retainer assembling method Grant 8,793,851 - Shiga , et al. August 5, 2 | 2014-08-05 |
Semiconductor Device App 20130264696 - KAJIWARA; Ryoichi ;   et al. | 2013-10-10 |
Mosfet package Grant 8,455,986 - Kajiwara , et al. June 4, 2 | 2013-06-04 |
Retainer Assembling Apparatus And Retainer Assembling Method App 20120285015 - SHIGA; Hiroyuki ;   et al. | 2012-11-15 |
Semiconductor Device App 20120217556 - Kajiwara; Ryoichi ;   et al. | 2012-08-30 |
Semiconductor device Grant 8,183,607 - Kajiwara , et al. May 22, 2 | 2012-05-22 |
Semiconductor Device App 20110298020 - KAJIWARA; Ryoichi ;   et al. | 2011-12-08 |
MOSFET package Grant 7,985,991 - Kajiwara , et al. July 26, 2 | 2011-07-26 |
Drill rod, drill bit, and drilling tool Grant 7,942,216 - Hisada , et al. May 17, 2 | 2011-05-17 |
Apparatus and a method of soldering a part to a board Grant 7,649,159 - Matsuura , et al. January 19, 2 | 2010-01-19 |
Drill Rod, Drill Bit, And Drilling Tool App 20090260892 - Hisada; Masaya ;   et al. | 2009-10-22 |
Semiconductor Device App 20080169537 - KAJIWARA; Ryoichi ;   et al. | 2008-07-17 |
MOSFET package Grant 7,400,002 - Kajiwara , et al. July 15, 2 | 2008-07-15 |
MOSFET package Grant 7,394,146 - Kajiwara , et al. July 1, 2 | 2008-07-01 |
MOSFET package Grant 7,342,267 - Kajiwara , et al. March 11, 2 | 2008-03-11 |
MOSFET package Grant 7,332,757 - Kajiwara , et al. February 19, 2 | 2008-02-19 |
Semiconductor device App 20070040248 - Kajiwara; Ryoichi ;   et al. | 2007-02-22 |
Semiconductor device App 20070040250 - Kajiwara; Ryoichi ;   et al. | 2007-02-22 |
Semiconductor device App 20070040249 - Kajiwara; Ryoichi ;   et al. | 2007-02-22 |
Semiconductor device App 20070029540 - Kajiwara; Ryoichi ;   et al. | 2007-02-08 |
Apparatus and a method of soldering a part to a board App 20070023486 - Matsuura; Masanari ;   et al. | 2007-02-01 |
Circuit board Grant 7,141,741 - Yamada , et al. November 28, 2 | 2006-11-28 |
Semiconductor device App 20060197196 - Kajiwara; Ryoichi ;   et al. | 2006-09-07 |
Semiconductor device App 20060197200 - Kajiwara; Ryoichi ;   et al. | 2006-09-07 |
Semiconductor device App 20040217474 - Kajiwara, Ryoichi ;   et al. | 2004-11-04 |
Flip chip assembly structure for semiconductor device and method of assembling therefor Grant 6,798,072 - Kajiwara , et al. September 28, 2 | 2004-09-28 |
Semiconductor device and manufacturing method thereof Grant 6,784,554 - Kajiwara , et al. August 31, 2 | 2004-08-31 |
Semiconductor device Grant 6,774,466 - Kajiwara , et al. August 10, 2 | 2004-08-10 |
Semiconductor device App 20040150082 - Kajiwara, Ryoichi ;   et al. | 2004-08-05 |
Circuit board App 20040056349 - Yamada, Kazuji ;   et al. | 2004-03-25 |
Semiconductor device and manufacturing method thereof App 20030127747 - Kajiwara, Ryoichi ;   et al. | 2003-07-10 |
Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin material Grant 6,569,764 - Hirashima , et al. May 27, 2 | 2003-05-27 |
Honeycomb structure Grant 6,524,680 - Tanaka , et al. February 25, 2 | 2003-02-25 |
Semiconductor device App 20030016502 - Yamada, Kazuji ;   et al. | 2003-01-23 |
Semiconductor package and flip chip bonding method therein App 20030001286 - Kajiwara, Ryoichi ;   et al. | 2003-01-02 |
Flip chip assembly structure for semiconductor device and method of assembling therefor App 20020056906 - Kajiwara, Ryoichi ;   et al. | 2002-05-16 |
Colored translucent golf driver head Grant D448,824 - Koizumi , et al. October 2, 2 | 2001-10-02 |
Fuel injection valve App 20010010341 - Koizumi, Masahiro ;   et al. | 2001-08-02 |
Semiconductor device having power semiconductor elements Grant 5,956,231 - Yamada , et al. September 21, 1 | 1999-09-21 |
System for sub-data processor identifies the peripheral from supplied identification data and supplies data indicative of the kind of peripheral to main data processor Grant 5,892,974 - Koizumi , et al. April 6, 1 | 1999-04-06 |
Ultrasonic bonding method and ultrasonic bonding apparatus Grant 5,884,835 - Kajiwara , et al. March 23, 1 | 1999-03-23 |
System for peripheral identification obtained by calculation and manipulation data collecting for determining communication mode and collecting data from first terminal contacts Grant 5,872,999 - Koizumi , et al. February 16, 1 | 1999-02-16 |
System and method for determining peripheral's communication mode over row of pins disposed in a socket connector Grant 5,630,170 - Koizumi , et al. May 13, 1 | 1997-05-13 |
Semiconductor device and production process thereof, as well as wire bonding device used therefor Grant 4,976,393 - Nakajima , et al. December 11, 1 | 1990-12-11 |
Semiconductor device Grant 4,965,656 - Koubuchi , et al. October 23, 1 | 1990-10-23 |
Corrosion-resistant aluminum electronic material Grant 4,912,544 - Onuki , et al. March 27, 1 | 1990-03-27 |
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