KOISHIKAWA; Jun

Patent Applications and Registrations

Patent applications and USPTO patent grants for KOISHIKAWA; Jun.The latest application filed is for "circuit-including film".

Company Profile

3.3.10

KOISHIKAWA; Jun - Tokyo JP
Koishikawa; Jun - Chiyoda-ku JP
KOISHIKAWA; JUN - SAGAMIHARA CITY JP
Koishikawa; Jun - Sagamihara JP
Koishikawa; Jun - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit-including Film App 20210114351 - SHIMAZUMI; Yumi ; et al.	2021-04-22
Molded foam body, dam rubber, composite body of dam rubber and panel, and method for increasing sound transmission loss Grant 10,815,352 - Morishita , et al. October 27, 2	2020-10-27
Polyvinyl Acetal Resin Film For Laminated Glass App 20200023620 - ISOUE; Koichiro ; et al.	2020-01-23
Polyvinyl Acetal Resin Film For Laminated Glass App 20200017675 - ISOUE; Koichiro ; et al.	2020-01-16
Molded Foam Body, Dam Rubber, Composite Body Of Dam Rubber And Panel, And Method For Increasing Sound Transmission Loss App 20190284362 - MORISHITA; Yoshihiro ; et al.	2019-09-19
Light Weight Glass Laminates App 20140017455 - TAKAGI; NAOTO ; et al.	2014-01-16
Light Weight Solar Cell Modules App 20120097219 - Takagi; Naoto ; et al.	2012-04-26
Light Weight Glass Laminates App 20120094100 - Takagi; Naoto ; et al.	2012-04-19
Light Weight Solar Cell Modules App 20100224235 - TAKAGI; NAOTO ; et al.	2010-09-09
Light Weight Glass Laminates App 20100227135 - TAKAGI; NAOTO ; et al.	2010-09-09
Photosensitive thick-film paste materials for forming light-transmitting electromagnetic shields, light-transmitting electromagnetic shields formed using the same, and method of manufacture thereof App 20050037278 - Koishikawa, Jun ; et al.	2005-02-17
Thick film conductor paste for automotive glass Grant 5,616,173 - Okamoto , et al. April 1, 1	1997-04-01
Method of manufacturing gas discharge display device Grant 5,011,391 - Kawasaki , et al. April 30, 1	1991-04-30

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