loadpatents
Patent applications and USPTO patent grants for Koike; Yoshihiko.The latest application filed is for "power semiconductor module".
Patent | Date |
---|---|
Power semiconductor module Grant 9,000,601 - Azuma , et al. April 7, 2 | 2015-04-07 |
Power Semiconductor Module App 20130001805 - AZUMA; Katsunori ;   et al. | 2013-01-03 |
Power semiconductor module and fabrication method thereof Grant 8,304,889 - Oyama , et al. November 6, 2 | 2012-11-06 |
Power semiconductor module and fabrication method thereof Grant 8,283,763 - Oyama , et al. October 9, 2 | 2012-10-09 |
Power Semiconductor Module And Fabrication Method Thereof App 20100176505 - OYAMA; Kazuhiro ;   et al. | 2010-07-15 |
Marginless status determination circuit Grant 7,454,649 - Yoshida , et al. November 18, 2 | 2008-11-18 |
Abnormality detection device for detecting an abnormality in a communication bus Grant 7,424,383 - Nakatsuhama , et al. September 9, 2 | 2008-09-09 |
Power Semiconductor Module and Fabrication Method Thereof App 20070290305 - Oyama; Kazuhiro ;   et al. | 2007-12-20 |
Memory control circuit, memory device, and microcomputer Grant 7,174,435 - Yoshida , et al. February 6, 2 | 2007-02-06 |
Circuit board Grant 7,141,741 - Yamada , et al. November 28, 2 | 2006-11-28 |
Semiconductor device including an external oscillation circuit Grant 7,135,939 - Koike , et al. November 14, 2 | 2006-11-14 |
Marginless status determination circuit App 20060208745 - Yoshida; Kenji ;   et al. | 2006-09-21 |
Semiconductor device Grant 7,091,518 - Yoshida , et al. August 15, 2 | 2006-08-15 |
Semiconductor device App 20060049400 - Yoshida; Tetsuya ;   et al. | 2006-03-09 |
Composite material including copper and cuprous oxide and application thereof Grant 6,909,185 - Kondo , et al. June 21, 2 | 2005-06-21 |
Semiconductor device App 20050128013 - Koike, Yoshihiko ;   et al. | 2005-06-16 |
Composite material including copper and cuprous oxide and application thereof Grant 6,833,617 - Kondo , et al. December 21, 2 | 2004-12-21 |
Memory control circuit, memory device, and microcomputer App 20040139289 - Yoshida, Tetsuya ;   et al. | 2004-07-15 |
Circuit board App 20040056349 - Yamada, Kazuji ;   et al. | 2004-03-25 |
Composite material, and manufacturing method and uses of same Grant 6,646,344 - Okamoto , et al. November 11, 2 | 2003-11-11 |
Composite material, and manufacturing method and uses of same Grant 6,630,734 - Okamoto , et al. October 7, 2 | 2003-10-07 |
Semiconductor device Grant 6,621,328 - Koike , et al. September 16, 2 | 2003-09-16 |
Composite material, and manufacturing method and uses of same Grant 6,611,056 - Okamoto , et al. August 26, 2 | 2003-08-26 |
Composite material including copper and cuprous oxide and application thereof App 20030146499 - Kondo, Yasuo ;   et al. | 2003-08-07 |
Composite material including copper and cuprous oxide and application thereof App 20030146498 - Kondo, Yasuo ;   et al. | 2003-08-07 |
Semiconductor device App 20030038673 - Koike, Yoshihiko ;   et al. | 2003-02-27 |
Semiconductor device App 20030016502 - Yamada, Kazuji ;   et al. | 2003-01-23 |
Composite material, and manufacturing method and uses of same App 20020145195 - Okamoto, Kazutaka ;   et al. | 2002-10-10 |
Composite material, and manufacturing method and uses of same App 20020135061 - Okamoto, Kazutaka ;   et al. | 2002-09-26 |
Abnormality detection device for detecting an abnormality in a communication bus App 20010023392 - Nakatsuhama, Norihiro ;   et al. | 2001-09-20 |
Semiconductor device having power semiconductor elements Grant 5,956,231 - Yamada , et al. September 21, 1 | 1999-09-21 |
Semiconductor module including switching device chips and diode chips Grant 5,929,519 - Mori , et al. July 27, 1 | 1999-07-27 |
Semiconductor module for a power conversion device Grant 5,801,936 - Mori , et al. September 1, 1 | 1998-09-01 |
Power conversion device and semiconductor module suitable for use in the device Grant 5,731,970 - Mori , et al. March 24, 1 | 1998-03-24 |
Semiconductor device having thermal stress resistance structure Grant 5,621,243 - Baba , et al. April 15, 1 | 1997-04-15 |
Semiconductor module with an improved heat sink/insulation plate arrangement Grant 5,585,672 - Koike , et al. December 17, 1 | 1996-12-17 |
Neutral-point clamped inverter device using semiconductor modules Grant 5,459,655 - Mori , et al. October 17, 1 | 1995-10-17 |
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