Koide; Takanori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Koide; Takanori.The latest application filed is for "organometallic compound and method of manufacturing integrated circuit using the same".

Company Profile

3.5.10

Koide; Takanori - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Aluminum compound and method for manufacturing semiconductor device using the same Grant 11,332,486 - Park , et al. May 17, 2	2022-05-17
Organometallic Compound And Method Of Manufacturing Integrated Circuit Using The Same App 20210388010 - RYU; Seungmin ; et al.	2021-12-16
Materials For Fabricating Thin Films, Methods Of Fabricating Thin Films Using The Same, And Equipment For Fabricating Thin Films Using The Same App 20210380622 - Ryu; Seung-Min ; et al.	2021-12-09
Organometallic Adduct Compound And Method Of Manufacturing Integrated Circuit Using The Same App 20210284667 - RYU; Seungmin ; et al.	2021-09-16
Niobium Compound And Method Of Forming Thin Film App 20210040130 - LEE; Soyoung ; et al.	2021-02-11
Metal Compounds And Methods Of Fabricating Semiconductor Devices Using The Same App 20200361970 - RYU; SEUNG-MIN ; et al.	2020-11-19
Aluminum Compound And Method For Manufacturing Semiconductor Device Using The Same App 20200207790 - Park; Gyu-Hee ; et al.	2020-07-02
Tantalum compound Grant 10,651,031 - Ryu , et al.	2020-05-12
Tantalum Compound App 20190074175 - RYU; Seung-min ; et al.	2019-03-07
Tantalum compound and methods of forming thin film and fabricating integrated circuit device by using the same Grant 10,134,582 - Ryu , et al. November 20, 2	2018-11-20
Nickel compound and method of forming thin film using the nickel compound Grant 9,790,246 - Youn , et al. October 17, 2	2017-10-17
Nickel Compound And Method Of Forming Thin Film Using The Nickel Compound App 20170198001 - Youn; Sang-chul ; et al.	2017-07-13
Tantalum Compound And Methods Of Forming Thin Film And Fabricating Integrated Circuit Device By Using The Same App 20170178961 - RYU; Seung-min ; et al.	2017-06-22
Method of forming thin film using a heterostructured nickel compound Grant 9,637,511 - Youn , et al. May 2, 2	2017-05-02
Nickel Compound And Method Of Forming Thin Film Using The Nickel Compound App 20150266913 - Youn; Sang-chul ; et al.	2015-09-24

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