Koide; Masato

Patent Applications and Registrations

Patent applications and USPTO patent grants for Koide; Masato.The latest application filed is for "hot rolled plate made of copper alloy used for a sputtering target and sputtering target".

Company Profile

0.5.5

Koide; Masato - Kagawa-gun JP
Koide; Masato - Osaka JP
Koide; Masato - Iwaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Copper wire rod and magnet wire Grant 9,679,676 - Koide , et al. June 13, 2	2017-06-13
Hot rolled plate made of copper alloy used for a sputtering target and sputtering target Grant 9,437,405 - Okubo , et al. September 6, 2	2016-09-06
Hot Rolled Plate Made Of Copper Alloy Used For A Sputtering Target And Sputtering Target App 20150318153 - OKUBO; Kiyoyuki ; et al.	2015-11-05
Copper Wire Rod And Magnet Wire App 20150213921 - Koide; Masato ; et al.	2015-07-30
Mn-containing copper alloy sputtering target generating few particles Grant 9,028,658 - Aoki , et al. May 12, 2	2015-05-12
Processed High-purity Copper Material Having Uniform And Fine Crystalline Structure, And Process For Production Thereof App 20120328468 - Kumagai; Satoshi ; et al.	2012-12-27
Sputtering Target For Forming Thin Film Transistor Wiring Film App 20110192719 - Maki; Kazunari ; et al.	2011-08-11
Mn-CONTAINING COPPER ALLOY SPUTTERING TARGET GENERATING FEW PARTICLES App 20090101495 - Aoki; Shoji ; et al.	2009-04-23
Manufacturing method of extra fine wire Grant 4,901,550 - Koide , et al. February 20, 1	1990-02-20

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