| Patent | Date |
|---|
Circuit board, method of manufacturing circuit board, and electronic device
Grant 11,317,520 - Furuyama , et al. April 26, 2 | 2022-04-26 |
Method of manufacturing board
Grant 10,396,020 - Fukui , et al. A | 2019-08-27 |
Circuit Board, Method Of Manufacturing Circuit Board, And Electronic Device
App 20190053385 - Furuyama; Masaharu ; et al. | 2019-02-14 |
Package substrate and method of manufacturing package substrate
Grant 10,181,437 - Watanabe , et al. Ja | 2019-01-15 |
Package Substrate And Method Of Manufacturing Package Substrate
App 20180358289 - WATANABE; MANABU ; et al. | 2018-12-13 |
Board And Method Of Manufacturing Board
App 20180315687 - FUKUI; Kei ; et al. | 2018-11-01 |
Circuit board and electronic device
Grant 9,699,887 - Mizutani , et al. July 4, 2 | 2017-07-04 |
Package mounting structure
Grant 9,515,005 - Baba , et al. December 6, 2 | 2016-12-06 |
Package Mounting Structure
App 20140376187 - Baba; Shunji ; et al. | 2014-12-25 |
Method of manufacturing semiconductor device mounting structure
Grant 8,866,270 - Watanabe , et al. October 21, 2 | 2014-10-21 |
Circuit Board And Electronic Device
App 20140293566 - Mizutani; Daisuke ; et al. | 2014-10-02 |
Multichip module and method for manufacturing the same
Grant 8,811,031 - Koide , et al. August 19, 2 | 2014-08-19 |
Method Of Manufacturing Semiconductor Device Mounting Structure
App 20140193953 - WATANABE; Manabu ; et al. | 2014-07-10 |
Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same
Grant 8,740,047 - Sakuyama , et al. June 3, 2 | 2014-06-03 |
Semiconductor device mounting structure, method of manufacturing the same, and electronic apparatus
Grant 8,716,839 - Watanabe , et al. May 6, 2 | 2014-05-06 |
Method Of Manufacturing Electronic Apparatus, Electronic Component-mounting Board, And Method Of Manufacturing The Same
App 20140008114 - Sakuyama; Seiki ; et al. | 2014-01-09 |
Semiconductor Device Mounting Structure, Method Of Manufacturing The Same, And Electronic Apparatus
App 20130341767 - WATANABE; Manabu ; et al. | 2013-12-26 |
Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same
Grant 8,556,157 - Sakuyama , et al. October 15, 2 | 2013-10-15 |
Electronic part and method of manufacturing the same
Grant 8,546,187 - Koide , et al. October 1, 2 | 2013-10-01 |
Multi-chip module
Grant 8,446,020 - Koide , et al. May 21, 2 | 2013-05-21 |
Electronic part and method of manufacturing the same
Grant 8,368,230 - Koide February 5, 2 | 2013-02-05 |
Interconnect board, printed circuit board unit, and method
Grant 8,289,728 - Koide October 16, 2 | 2012-10-16 |
Method Of Manufacturing Electronic Apparatus, Electronic Component-mounting Board, And Method Of Manufacturing The Same
App 20110220398 - Sakuyama; Seiki ; et al. | 2011-09-15 |
Multi-chip Module
App 20110089579 - KOIDE; Masateru ; et al. | 2011-04-21 |
Interconnect Board, Printed Circuit Board Unit, And Method
App 20110080718 - KOIDE; Masateru | 2011-04-07 |
Interconnect Board, Printed Circuit Board Unit, And Method
App 20110080717 - KOIDE; Masateru ; et al. | 2011-04-07 |
Multilayer interconnection substrate and manufacturing method therefor
Grant 7,915,541 - Koide , et al. March 29, 2 | 2011-03-29 |
Multi-chip Module And Method Of Manufacturing The Same
App 20110042806 - Koide; Masateru ; et al. | 2011-02-24 |
Multichip Module And Method For Manufacturing The Same
App 20110044015 - KOIDE; Masateru ; et al. | 2011-02-24 |
Multi-chip Module And Method Of Manufacturing The Same
App 20110042824 - KOIDE; Masateru | 2011-02-24 |
Semiconductor Package And Electronic Device
App 20090079062 - KOIDE; Masateru | 2009-03-26 |
Multilayer Interconnection Substrate And Manufacturing Method Therefor
App 20080192453 - Koide; Masateru ; et al. | 2008-08-14 |
Circuit board with a thin-film layer configured to accommodate a passive element
Grant 7,301,230 - Koide November 27, 2 | 2007-11-27 |
Semiconductor Device
App 20070262427 - KOIDE; Masateru | 2007-11-15 |
Packaging method, packaging structure and package substrate for electronic parts
Grant 7,291,901 - Koide , et al. November 6, 2 | 2007-11-06 |
Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreader
App 20070228530 - Sato; Toshihisa ; et al. | 2007-10-04 |
Packaging method, packaging structure and package substrate for electronic parts
Grant 7,268,002 - Koide , et al. September 11, 2 | 2007-09-11 |
Power supply connection structure to a semiconductor device
Grant 7,057,272 - Koide June 6, 2 | 2006-06-06 |
Packaging method, packaging structure and package substrate for electronic parts
App 20060063303 - Koide; Masateru ; et al. | 2006-03-23 |
Substrate manufacturing method and circuit board
App 20060056162 - Koide; Masateru | 2006-03-16 |
Power supply connection structure to a semiconductor device
App 20050146017 - Koide, Masateru | 2005-07-07 |
Packaging method, packaging structure and package substrate for electronic parts
App 20040183193 - Koide, Masateru ; et al. | 2004-09-23 |
Apparatus for laser cutting wiring in accordance with a measured size of the wiring
Grant 5,670,067 - Koide , et al. September 23, 1 | 1997-09-23 |
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