loadpatents
name:-0.03305983543396
name:-0.01626181602478
name:-0.0016670227050781
Kohl; Paul Patent Filings

Kohl; Paul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kohl; Paul.The latest application filed is for "hybrid ionomer electrochemical devices".

Company Profile
0.13.18
  • Kohl; Paul - Atlanta GA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Photosensitive sacrificial polymer with low residue
Grant 8,999,629 - Kohl , et al. April 7, 2
2015-04-07
Hybrid Ionomer Electrochemical Devices
App 20150064581 - UNLU; Murat ;   et al.
2015-03-05
Electrochemical devices based on multiple junction ionic conductive membranes
App 20150044579 - Unlu; Murat ;   et al.
2015-02-12
Electrochemical devices based on multiple junction ionic conductive membranes
Grant 8,895,196 - Unlu , et al. November 25, 2
2014-11-25
Photosensitive Sacrificial Polymer With Low Residue
App 20140272708 - KOHL; PAUL ;   et al.
2014-09-18
Polyhedral Oligomeric Silsesquioxane Compositions, Methods Of Using These Compositions, And Structures Including These Compositions
App 20120219793 - Fritz; Nathan ;   et al.
2012-08-30
Electrochemical devices based on multiple junction ionic conductive membranes
App 20120178000 - Unlu; Murat ;   et al.
2012-07-12
Microstructures and methods of fabrication thereof
Grant 7,875,404 - Moore , et al. January 25, 2
2011-01-25
Hybrid Ionomer Electrochemical Devices
App 20100028736 - UNLU; Murat ;   et al.
2010-02-04
High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use
Grant 7,554,347 - Mule' , et al. June 30, 2
2009-06-30
Microstructures And Methods Of Fabrication Thereof
App 20080241604 - Moore; Christopher W. ;   et al.
2008-10-02
Systems and methods for three-dimensional lithography and nano-indentation
App 20050257709 - Mule, Tony ;   et al.
2005-11-24
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package
Grant 6,954,576 - Mule' , et al. October 11, 2
2005-10-11
Optical waveguides formed from nano air-gap inter-layer dielectric materials and methods of fabrication thereof
Grant 6,947,651 - September 20, 2
2005-09-20
Method of making an electrostatic actuator
Grant 6,933,165 - Musolf , et al. August 23, 2
2005-08-23
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package
App 20040264840 - Mule, Tony ;   et al.
2004-12-30
Optical waveguides with embedded air-gap cladding layer and methods of fabrication thereof
Grant 6,807,352 - October 19, 2
2004-10-19
Method of making an electrostatic actuator
App 20040180465 - Musolf, Jurgen ;   et al.
2004-09-16
Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication
Grant 6,788,867 - Mule' , et al. September 7, 2
2004-09-07
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package
Grant 6,785,458 - Mule' , et al. August 31, 2
2004-08-31
Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication
App 20040126076 - Mule, Tony ;   et al.
2004-07-01
Compliant wafer-level packaging devices and methods of fabrication
Grant 6,690,081 - Bakir , et al. February 10, 2
2004-02-10
Electrostatic actuators with intrinsic stress gradient
Grant 6,625,004 - Musolf , et al. September 23, 2
2003-09-23
Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication
App 20030012539 - Mule', Tony ;   et al.
2003-01-16
Optical waveguides formed from nano air-gap inter-layer dielectric materials and methods of fabrication thereof
App 20020186950 - Mule', Tony ;   et al.
2002-12-12
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package
App 20020136481 - Mule', Tony ;   et al.
2002-09-26
Compliant wafer-level packaging devices and methods of fabrication
App 20020127768 - Badir, Muhannad S. ;   et al.
2002-09-12
Optical waveguides with embedded air-gap cladding layer and methods of fabrication thereof
App 20020122648 - Mule', Tony ;   et al.
2002-09-05

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