| Patent | Date |
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Method of fabricating a circuit structure
Grant 8,590,145 - Eichelberger , et al. November 26, 2 | 2013-11-26 |
Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system
Grant 8,564,119 - Eichelberger , et al. October 22, 2 | 2013-10-22 |
Method of bonding two structures together with an adhesive line of controlled thickness
Grant 8,533,941 - Eichelberger , et al. September 17, 2 | 2013-09-17 |
Method Of Fabricating A Base Layer Circuit Structure
App 20130185935 - EICHELBEGER; Charles W. ; et al. | 2013-07-25 |
Method of fabricating a base layer circuit structure
Grant 8,474,133 - Eichelberger , et al. July 2, 2 | 2013-07-02 |
Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system
Grant 8,384,199 - Eichelberger , et al. February 26, 2 | 2013-02-26 |
Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system
Grant 8,324,020 - Eichelberger , et al. December 4, 2 | 2012-12-04 |
Stackable circuit structures and methods of fabrication thereof
Grant 8,169,065 - Kohl , et al. May 1, 2 | 2012-05-01 |
Stackable Circuit Structures And Methods Of Fabrication Thereof
App 20110147911 - Kohl; James E. ; et al. | 2011-06-23 |
Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer
Grant 7,868,445 - Kohl , et al. January 11, 2 | 2011-01-11 |
Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system
Grant 7,863,090 - Eichelberger , et al. January 4, 2 | 2011-01-04 |
Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system
Grant 7,830,000 - Eichelberger , et al. November 9, 2 | 2010-11-09 |
Integrated Conductive Structures And Fabrication Methods Thereof Facilitating Implementing A Cell Phone Or Other Electronic System
App 20100047970 - EICHELBERGER; Charles W. ; et al. | 2010-02-25 |
Integrated Thermal Structures And Fabrication Methods Thereof Facilitating Implementing A Cell Phone Or Other Electronic System
App 20100044855 - EICHELBERGER; Charles W. ; et al. | 2010-02-25 |
Methods Of Fabricating A Circuit Structure With A Strengthening Structure Over The Back Surface Of A Chip Layer
App 20100035384 - EICHELBERGER; Charles W. ; et al. | 2010-02-11 |
Method Of Bonding Two Structures Together With An Adhesive Line Of Controlled Thickness
App 20100032091 - EICHELBERGER; Charles W. ; et al. | 2010-02-11 |
Method Of Fabricating A Base Layer Circuit Structure
App 20100031500 - EICHELBERGER; Charles W. ; et al. | 2010-02-11 |
Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system
Grant 7,619,901 - Eichelberger , et al. November 17, 2 | 2009-11-17 |
Integrated Structures And Fabrication Methods Thereof Implementing A Cell Phone Or Other Electronic System
App 20080316714 - EICHELBERGER; Charles W. ; et al. | 2008-12-25 |
Integrated Thermal Structures And Fabrication Methods Thereof Facilitating Implementing A Cell Phone Or Other Electronic System
App 20080315404 - EICHELBERGER; Charles W. ; et al. | 2008-12-25 |
Packaged Electronic Modules And Fabrication Methods Thereof Implementing A Cell Phone Or Other Electronic System
App 20080315377 - EICHELBERGER; Charles W. ; et al. | 2008-12-25 |
Integrated Conductive Structures And Fabrication Methods Thereof Facilitating Implementing A Cell Phone Or Other Electronic System
App 20080315375 - EICHELBERGER; Charles W. ; et al. | 2008-12-25 |
Integrated Structures And Methods Of Fabrication Thereof With Fan-out Metallization On A Chips-first Chip Layer
App 20080315391 - Kohl; James E. ; et al. | 2008-12-25 |
Compliant, solderable input/output bump structures
Grant 6,818,544 - Eichelberger , et al. November 16, 2 | 2004-11-16 |
Compliant, solderable input/output bump structures
App 20030201534 - Eichelberger, Charles W. ; et al. | 2003-10-30 |
Integrated circuit structures and methods employing a low modulus high elongation photodielectric
Grant 6,426,545 - Eichelberger , et al. July 30, 2 | 2002-07-30 |
Electroless metal connection structures and methods
Grant 6,396,148 - Eichelberger , et al. May 28, 2 | 2002-05-28 |
Method of processing siloxane-polyimides for electronic packaging applications
Grant 4,897,153 - Cole , et al. January 30, 1 | 1990-01-30 |
Piezoelectric switch
Grant 4,742,263 - Harnden, Jr. , et al. May 3, 1 | 1988-05-03 |
Piezoelectric switch
Grant 4,697,118 - Harnden, Jr. , et al. September 29, 1 | 1987-09-29 |
High voltage semiconductor devices electrically isolated from an integrated circuit substrate
Grant 4,661,838 - Wildi , et al. April 28, 1 | 1987-04-28 |
Field shields for Schottky barrier devices
Grant H40 - Buchanan, Jr. , et al. April 1, 1 | 1986-04-01 |
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