| Patent | Date |
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Negative Electrode Current Collector For Secondary Battery
App 20200036010 - Kohiki; Michiya ; et al. | 2020-01-30 |
Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method
Grant 10,349,531 - Miyamoto , et al. July 9, 2 | 2019-07-09 |
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
Grant 10,257,938 - Kohiki | 2019-04-09 |
Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
Grant 10,187,983 - Kohiki , et al. Ja | 2019-01-22 |
Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
Grant 10,178,775 - Miyoshi , et al. J | 2019-01-08 |
Ultrathin copper foil and method of manufacturing the same, and ultrathin copper layer
Grant 9,930,776 - Kohiki March 27, 2 | 2018-03-27 |
Copper Foil Provided With Carrier, Laminate, Printed Wiring Board, Electronic Device And Method For Fabricating Printed Wiring Board
App 20180063950 - KOHIKI; Michiya | 2018-03-01 |
Copper Foil With Release Layer, Laminated Material, Method For Producing Printed Wiring Board, And Method For Producing Electronic Apparatus
App 20170362733 - KOHIKI; MICHIYA | 2017-12-21 |
Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
Grant 9,839,124 - Kohiki December 5, 2 | 2017-12-05 |
Copper foil with carrier
Grant 9,788,423 - Nagaura , et al. October 10, 2 | 2017-10-10 |
Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring board
Grant 9,578,741 - Nagaura , et al. February 21, 2 | 2017-02-21 |
Carrier-Attached Copper Foil, Laminate, Laminate Producing Method, Printed Wiring Board Producing Method, And Electronic Device Producing Method
App 20170019991 - Miyamoto; Nobuaki ; et al. | 2017-01-19 |
Copper Foil With Carrier, Laminate, Printed Wiring Board, And Method Of Producing Electronic Devices
App 20160381805 - MIYOSHI; YOSHIYUKI ; et al. | 2016-12-29 |
Copper Foil With Carrier, Laminate, Printed Wiring Board, And Method Of Producing Electronic Devices
App 20160381806 - MIYOSHI; YOSHIYUKI ; et al. | 2016-12-29 |
Copper Foil With Carrier, Laminate, Method Of Producing Printed Wiring Board, And Method Of Producing Electronic Devices
App 20160374205 - MORIYAMA; TERUMASA ; et al. | 2016-12-22 |
Copper Foil With Carrier
App 20160242281 - Nagaura; Tomota ; et al. | 2016-08-18 |
Copper Foil Provided With Carrier, Laminate, Printed Wiring Board, Electronic Device And Method For Fabricating Printed Wiring Board
App 20160234935 - KOHIKI; MICHIYA | 2016-08-11 |
Copper Foil Provided With Carrier, Laminate, Printed Wiring Board, And Method For Fabricating Printed Wiring Board
App 20160212857 - MIYOSHI; YOSHIYUKI ; et al. | 2016-07-21 |
Copper Foil Provided With Carrier, Laminate, Printed Wiring Board, Electronic Device, And Method For Fabricating Printed Wiring Board
App 20160212846 - KOHIKI; Michiya ; et al. | 2016-07-21 |
Surface-treated Copper Foil, Copper Foil With Carrier, Substrate, Resin Substrate, Printed Wiring Board, Copper Clad Laminate And Method For Producing Printed Wiring Board
App 20160157356 - KOHIKI; MICHIYA | 2016-06-02 |
Ultrathin Copper Foil And Method Of Manufacturing The Same, And Ultrathin Copper Layer
App 20150195909 - Kohiki; Michiya | 2015-07-09 |
Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board and printed wiring board
Grant 9,028,972 - Kohiki , et al. May 12, 2 | 2015-05-12 |
Copper Foil with Carrier, Method of Producing Same, Copper Foil with Carrier for Printed Wiring Board, and Printed Wiring Board
App 20150047884 - Nagaura; Tomota ; et al. | 2015-02-19 |
Electrolytic Copper Foil, and Negative Electrode Current Collector for Secondary Battery
App 20140346048 - Kohiki; Michiya ; et al. | 2014-11-27 |
Electrolytic Copper Foil And Production Method Of Electrolytic Copper Foil
App 20140318973 - Kohiki; Michiya | 2014-10-30 |
Process and apparatus for producing a metal covered polyimide composite
Grant 8,721,864 - Kohiki , et al. May 13, 2 | 2014-05-13 |
Electrolytic Copper Foil For An Anode Of A Negative Electrode Collector In A Secondary Battery And Method Of Producing The Same
App 20140030591 - Kohiki; Michiya ; et al. | 2014-01-30 |
Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit board
Grant 8,568,899 - Kohiki , et al. October 29, 2 | 2013-10-29 |
Electrolytic Copper Foil
App 20130256140 - Kohiki; Michiya | 2013-10-03 |
Copper Foil For Printed Wiring Board, Method For Producing Said Copper Foil, Resin Substrate For Printed Wiring Board And Printed Wiring Board
App 20130220685 - Kohiki; Michiya ; et al. | 2013-08-29 |
Process and Apparatus for Producing a Metal Covered Polyimide Composite
App 20120132531 - Kohiki; Michiya ; et al. | 2012-05-31 |
Metal Covered Polyimide Composite, Process for Producing the Composite, and Process for Producing Electronic Circuit Board
App 20100221563 - Kohiki; Michiya ; et al. | 2010-09-02 |
Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite
App 20100215982 - Kohiki; Michiya ; et al. | 2010-08-26 |
Two-Layered Copper-Clad Laminate
App 20100040873 - Kohiki; Michiya ; et al. | 2010-02-18 |
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