KOHAMA; Norifumi
Patent Applications and Registrations
Patent applications and USPTO patent grants for KOHAMA; Norifumi.The latest application filed is for "plasma processing method and plasma processing apparatus".
- KOHAMA; Norifumi - Kumamoto JP
- Kohama; Norifumi - Koshi-shi Kumamoto
- Kohama; Norifumi - Koshi City Kumamoto
- Kohama; Norifumi - Koshi JP
| Patent | Date |
|---|---|
| Plasma Processing Method And Plasma Processing Apparatus App 20220262631 - ITOH; Satoshi ; et al. | 2022-08-18 |
| Parameter Adjustment Method Of Bonding Apparatus And Bonding System App 20210327773 - Kohama; Norifumi | 2021-10-21 |
| Substrate Processing Method, Modification Device And Substrate Processing System App 20210242027 - Kohama; Norifumi ; et al. | 2021-08-05 |
| Bonding apparatus and bonding method Grant 10,964,563 - Wada , et al. March 30, 2 | 2021-03-30 |
| Substrate Processing Apparatus And Substrate Processing Method App 20210035827 - Motoda; Kimio ; et al. | 2021-02-04 |
| Bonding Apparatus And Bonding Method App 20180323089 - Wada; Norio ; et al. | 2018-11-08 |
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