Patent | Date |
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Composition For Etching Silicon Nitride Film And Etching Method Using Same App 20210363423 - HWANG; Ki Wook ;   et al. | 2021-11-25 |
Composition for forming silica layer, silica layer, and electronic device Grant 10,020,185 - Yun , et al. July 10, 2 | 2018-07-10 |
Curable organo polysiloxane composition, encapsulant, and electronic device Grant 9,695,287 - Yoo , et al. July 4, 2 | 2017-07-04 |
Curable polysiloxane composition for optical device and encapsulant and optical device Grant 9,657,143 - Kim , et al. May 23, 2 | 2017-05-23 |
Composition for encapsulant, encapsulant, and electronic element Grant 9,441,111 - Koh , et al. September 13, 2 | 2016-09-13 |
Rinse Solution For Silica Thin Film, Method Of Producing Silica Thin Film, And Silica Thin Film App 20160172188 - Lim; Wan-Hee ;   et al. | 2016-06-16 |
Composition For Forming Silica Layer, Silica Layer, And Electronic Device App 20160099145 - Yun; Hui-Chan ;   et al. | 2016-04-07 |
Curable Organo Polysiloxane Composition, Encapsulant, And Electronic Device App 20160093825 - YOO; Hong-Jung ;   et al. | 2016-03-31 |
Resist underlayer composition and method of manufacturing semiconductor integrated circuit device using the same Grant 9,291,899 - Cho , et al. March 22, 2 | 2016-03-22 |
Organic Polysiloxane Composition, Encapsulant, And Electronic Device App 20150376453 - LEE; Ji-Ho ;   et al. | 2015-12-31 |
Curable Polysiloxane Composition For Optical Device And Encapsulant And Optical Device App 20150353688 - KIM; Young-Ho ;   et al. | 2015-12-10 |
Composition For Encapsulant, Encapsulant, And Electronic Element App 20150299464 - KOH; Sang-Ran ;   et al. | 2015-10-22 |
Resin for transparent encapsulation material, and associated encapsulation material and electronic device Grant 9,147,626 - Cha , et al. September 29, 2 | 2015-09-29 |
Hardmask Composition For Forming Resist Underlayer Film, Process For Producing A Semiconductor Integrated Circuit Device, And Semiconductor Integrated Circuit Device App 20150041959 - KOH; Sang Ran ;   et al. | 2015-02-12 |
Hardmask composition and associated methods Grant 8,916,329 - Kim , et al. December 23, 2 | 2014-12-23 |
Resin For Transparent Encapsulation Material, And Associated Encapsulation Material And Electronic Device App 20140357792 - CHA; Sung-Hwan ;   et al. | 2014-12-04 |
Polyorganosiloxane, encapsulation material obtained from the polyorganosiloxane, and electronic device including the encapsulation material Grant 8,877,877 - Koh , et al. November 4, 2 | 2014-11-04 |
Resin for transparent encapsulation material, and associated encapsulation material and electronic device Grant 8,847,414 - Cha , et al. September 30, 2 | 2014-09-30 |
Photoresist underlayer composition and method of manufacturing semiconductor device by using the same Grant 8,758,981 - Kim , et al. June 24, 2 | 2014-06-24 |
Silicon-based hardmask composition and process of producing semiconductor integrated circuit device using the same Grant 8,524,851 - Kim , et al. September 3, 2 | 2013-09-03 |
Transparent resin for encapsulation material and electronic device including the same Grant 8,512,870 - Shin , et al. August 20, 2 | 2013-08-20 |
Resin composition for transparent encapsulation material and electronic device formed using the same Grant 8,455,605 - Koh , et al. June 4, 2 | 2013-06-04 |
Hybrid siloxane polymer, encapsulant obtained from the siloxane polymer, and electronic device including the encapsulant Grant 8,344,075 - Kim , et al. January 1, 2 | 2013-01-01 |
Photoresist Underlayer Composition And Method Of Manufacturing Semiconductor Device By Using The Same App 20120282776 - KIM; Mi-Young ;   et al. | 2012-11-08 |
Resist Underlayer Composition And Process Of Producing Integrated Circuit Devices Using The Same App 20120267766 - KIM; Mi-Young ;   et al. | 2012-10-25 |
Resin Composition For Transparent Encapsulation Material And Electronic Device Formed Using The Same App 20120270998 - KOH; Sang-Ran ;   et al. | 2012-10-25 |
Resist Underlayer Composition And Method Of Manufacturing Semiconductor Integrated Circuit Devices Using The Same App 20120270143 - YUN; Hui-Chan ;   et al. | 2012-10-25 |
Transparent Resin For Encapsulation Material And Electronic Device Including The Same App 20120271006 - SHIN; June-Ho ;   et al. | 2012-10-25 |
Hardmask composition and associated methods Grant 8,273,519 - Kim , et al. September 25, 2 | 2012-09-25 |
Encapsulation Material And Electronic Device Prepared Using The Same App 20120168815 - Koh; Sang-Ran ;   et al. | 2012-07-05 |
Resin For Transparent Encapsulation Material, And Associated Encapsulation Material And Electronic Device App 20120168780 - CHA; Sung-Hwan ;   et al. | 2012-07-05 |
Polyorganosiloxane, Encapsulation Material Obtained From The Polyorganosiloxane, And Electronic Device Including The Encapsulation Material App 20120046423 - KOH; Sang-Ran ;   et al. | 2012-02-23 |
Modified Siloxane Polymer Composition, Encapsulant Obtained From The Modified Siloxane Polymer Composition, And Electronic Device Including The Encapsulant App 20120029157 - KIM; Woo-Han ;   et al. | 2012-02-02 |
Hybrid Siloxane Polymer, Encapsulant Obtained From The Siloxane Polymer, And Electronic Device Including The Encapsulant App 20120016083 - KIM; Woo-Han ;   et al. | 2012-01-19 |
Hardmask Composition For Forming Resist Underlayer Film, Process For Producing A Semiconductor Integrated Circuit Device, And Semiconductor Integrated Circuit Device App 20110241175 - KOH; Sang Ran ;   et al. | 2011-10-06 |
Silicon-based hardmask composition and process of producing semiconductor integrated circuit device using the same App 20100279509 - Kim; Sang Kyun ;   et al. | 2010-11-04 |
Resist Underlayer Composition And Method Of Manufacturing Integrated Circuit Device Using The Same App 20100167212 - Cho; Hyeon-Mo ;   et al. | 2010-07-01 |
Resist underlayer composition and method of manufacturing semiconductor integrated circuit device using the same App 20100167203 - Cho; Hyeon-Mo ;   et al. | 2010-07-01 |
Hardmask composition and associated methods App 20090226824 - Kim; Sang Kyun ;   et al. | 2009-09-10 |
Hardmask composition and associated methods App 20080118875 - Kim; Mi Young ;   et al. | 2008-05-22 |