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Koga; Kazuhiko Patent Filings

Koga; Kazuhiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Koga; Kazuhiko.The latest application filed is for "molded semiconductor device including ic-chip covered with conductor member".

Company Profile
0.3.3
  • Koga; Kazuhiko - Toyohashi-city JP
  • Koga; Kazuhiko - Toyohashi JP
  • Koga, Kazuhiko - Toyohashi-shi JP
  • Koga; Kazuhiko - Daito JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Molded semiconductor device including IC-chip covered with conductor member
App 20090072360 - Koga; Kazuhiko
2009-03-19
Sealing structure for connector
App 20050250371 - Koga, Kazuhiko
2005-11-10
Structure of electronic device providing decreased fatigue of wire
Grant 6,822,873 - Koga November 23, 2
2004-11-23
Structure of electronic device providing decreased fatigue of wire
App 20030165050 - Koga, Kazuhiko
2003-09-04
Pressure-adjusting device for adjusting output of integrated pressure sensor
Grant 5,528,214 - Koga , et al. June 18, 1
1996-06-18
A process for producing magnetic heads of the floating type
Grant 5,016,341 - Ogawa , et al. May 21, 1
1991-05-21

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