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Patent applications and USPTO patent grants for Koga; Kazuhiko.The latest application filed is for "molded semiconductor device including ic-chip covered with conductor member".
Patent | Date |
---|---|
Molded semiconductor device including IC-chip covered with conductor member App 20090072360 - Koga; Kazuhiko | 2009-03-19 |
Sealing structure for connector App 20050250371 - Koga, Kazuhiko | 2005-11-10 |
Structure of electronic device providing decreased fatigue of wire Grant 6,822,873 - Koga November 23, 2 | 2004-11-23 |
Structure of electronic device providing decreased fatigue of wire App 20030165050 - Koga, Kazuhiko | 2003-09-04 |
Pressure-adjusting device for adjusting output of integrated pressure sensor Grant 5,528,214 - Koga , et al. June 18, 1 | 1996-06-18 |
A process for producing magnetic heads of the floating type Grant 5,016,341 - Ogawa , et al. May 21, 1 | 1991-05-21 |
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