| Patent | Date |
|---|
Shaped interconnect bumps in semiconductor devices
Grant 11,444,048 - Koduri September 13, 2 | 2022-09-13 |
Multirow Gull-wing Package For Microelecronic Devices
App 20220277965 - Koduri; Sreenivasan K. | 2022-09-01 |
Integration of a passive component in a cavity of an integrated circuit package
Grant 11,430,722 - Morroni , et al. August 30, 2 | 2022-08-30 |
Printed Package And Method Of Making The Same
App 20220208701 - Koduri; Sreenivasan K. | 2022-06-30 |
Package For Power Semiconductor Devices
App 20220208745 - Koduri; Sreenivasan K. ; et al. | 2022-06-30 |
Integrated Circuit Package With Current Sense Element
App 20220187337 - NEIDORFF; Robert Allan ; et al. | 2022-06-16 |
Packaged Device Carrier For Thermal Enhancement Or Signal Redistribution Of Packaged Semiconductor Devices
App 20220189885 - Koduri; Sreenivasan K. | 2022-06-16 |
Multirow gull-wing package for microelectronic devices
Grant 11,335,570 - Koduri May 17, 2 | 2022-05-17 |
Packaged Device With Die Wrapped By A Substrate
App 20220077014 - Koduri; Sreenivasan K. | 2022-03-10 |
Multi-lead Adapter
App 20220077030 - Koduri; Sreenivasan K. ; et al. | 2022-03-10 |
Packaged device carrier for thermal enhancement or signal redistribution of packaged semiconductor devices
Grant 11,264,336 - Koduri March 1, 2 | 2022-03-01 |
Leadframes in Semiconductor Devices
App 20220037277 - Koduri; Sreenivasan K. | 2022-02-03 |
Automated Analog And Mixed-signal Circuit Design And Validation
App 20210390243 - FISCHER; Timothy W. ; et al. | 2021-12-16 |
Automated Analog And Mixed-signal Circuit Design And Validation
App 20210390232 - KHANDELWAL; Ashish ; et al. | 2021-12-16 |
Programmatic Circuit Partitioning And Topology Identification
App 20210390239 - KHANDELWAL; Ashish ; et al. | 2021-12-16 |
Multi-algorithmic Approach To Represent Highly Non-linear High Dimensional Space
App 20210390234 - GUPTA; Nikhil ; et al. | 2021-12-16 |
Automated Geometry Optimization For Analog, Mixed-signal Circuit Design
App 20210390233 - KHANDELWAL; Ashish ; et al. | 2021-12-16 |
Process Aware Compact Representation Of Integrated Circuits
App 20210390237 - KHANDELWAL; Ashish ; et al. | 2021-12-16 |
Packaged device with die wrapped by a substrate
Grant 11,201,096 - Koduri December 14, 2 | 2021-12-14 |
Integrated Capacitor With Extended Head Bump Bond Pillar
App 20210375731 - Koduri; Sreenivasan K. | 2021-12-02 |
Multi-pitch Leads
App 20210375729 - Koduri; Sreenivasan K. ; et al. | 2021-12-02 |
Microelectronic Device With Pillars Having Flared Ends
App 20210375812 - Koduri; Sreenivasan K. | 2021-12-02 |
Multi-lead adapter
Grant 11,177,195 - Koduri , et al. November 16, 2 | 2021-11-16 |
Wafer Level Bump Stack For Chip Scale Package
App 20210345495 - Koduri; Sreenivasan K | 2021-11-04 |
Leadframes in semiconductor devices
Grant 11,152,322 - Koduri October 19, 2 | 2021-10-19 |
Microelectronic device with pillars having flared ends
Grant 11,094,659 - Koduri August 17, 2 | 2021-08-17 |
Multi-pitch leads
Grant 11,094,616 - Koduri , et al. August 17, 2 | 2021-08-17 |
Integrated capacitor with extended head bump bond pillar
Grant 11,094,620 - Koduri August 17, 2 | 2021-08-17 |
Cantilevered Leadframe Support Structure for Magnetic Wireless Transfer between Integrated Circuit Dies
App 20210249336 - Sutton; Benjamin Michael ; et al. | 2021-08-12 |
Wafer level bump stack for chip scale package
Grant 11,064,615 - Koduri July 13, 2 | 2021-07-13 |
Pre-Molded Leadframes in Semiconductor Devices
App 20210210453 - Koduri; Sreenivasan K. | 2021-07-08 |
Packaged Device Carrier For Thermal Enhancement Or Signal Redistribution Of Packaged Semiconductor Devices
App 20210143106 - Koduri; Sreenivasan K. | 2021-05-13 |
Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies
Grant 10,991,641 - Sutton , et al. April 27, 2 | 2021-04-27 |
Electrical device terminal finishing
Grant 10,985,096 - Koduri April 20, 2 | 2021-04-20 |
Microelectronic Device With Pillars Having Flared Ends
App 20210098406 - Koduri; Sreenivasan K. | 2021-04-01 |
Wafer Level Bump Stack For Chip Scale Package
App 20210100108 - Koduri; Sreenivasan K. | 2021-04-01 |
Integrated Capacitor With Extended Head Bump Bond Pillar
App 20210098348 - Koduri; Sreenivasan K. | 2021-04-01 |
Pre-molded leadframes in semiconductor devices
Grant 10,957,666 - Koduri March 23, 2 | 2021-03-23 |
Multi-pitch Leads
App 20210050287 - KODURI; Sreenivasan K. ; et al. | 2021-02-18 |
Packaged Device With Die Wrapped By A Substrate
App 20210013116 - Koduri; Sreenivasan K. | 2021-01-14 |
Method Of Making A Semiconductor Package Having Projections
App 20200411416 - Koduri; Sreenivasan K. ; et al. | 2020-12-31 |
Three-dimensional Functional Integration
App 20200411420 - Koduri; Sreenivasan K. | 2020-12-31 |
Integrated circuit package including inward bent leads
Grant 10,840,171 - Meyers , et al. November 17, 2 | 2020-11-17 |
Multi-lead Adapter
App 20200343165 - KODURI; Sreenivasan K. ; et al. | 2020-10-29 |
Electrical Device Terminal Finishing
App 20200279800 - Koduri; Sreenivasan K. | 2020-09-03 |
Cantilevered Leadframe Support Structure for Magnetic Wireless Transfer between Integrated Circuit Dies
App 20200266131 - Sutton; Benjamin Michael ; et al. | 2020-08-20 |
Expanded Head Pillar For Bump Bonds
App 20200258856 - A1 | 2020-08-13 |
Integration of a passive component in an integrated circuit package
Grant 10,734,313 - Morroni , et al. | 2020-08-04 |
Multirow Gull-wing Package For Microelecronic Devices
App 20200203184 - Koduri; Sreenivasan K. | 2020-06-25 |
Universal Leaded/leadless Chip Scale Package For Microelecronic Devices
App 20200203243 - Koduri; Sreenivasan K. | 2020-06-25 |
Low Cost Reliable Fan-out Chip Scale Packages
App 20200203263 - Koduri; Sreenivasan K. | 2020-06-25 |
Low Cost Reliable Fan-out Fan-in Chip Scale Package
App 20200203242 - Koduri; Sreenivasan K. | 2020-06-25 |
Integrated Circuit Package Including Inward Bent Leads
App 20200168531 - MEYERS; MICHAEL L. ; et al. | 2020-05-28 |
Lidar Imaging Receiver
App 20200166645 - Koduri; Sreenivasan K. | 2020-05-28 |
Electrical device terminal finishing
Grant 10,658,278 - Koduri | 2020-05-19 |
Inductor On Microelectronic Die
App 20200144358 - Koduri; Sreenivasan K. | 2020-05-07 |
Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies
Grant 10,643,929 - Sutton , et al. | 2020-05-05 |
Expanded head pillar for bump bonds
Grant 10,636,758 - Koduri | 2020-04-28 |
Thermometer device and method of making
Grant 10,330,537 - Koduri | 2019-06-25 |
Structure And Method For Semiconductor Packaging
App 20190109105 - Koduri; Sreenivasan K. | 2019-04-11 |
Expanded Head Pillar For Bump Bonds
App 20190109108 - Koduri; Sreenivasan K | 2019-04-11 |
Leadframes in Semiconductor Devices
App 20190109016 - Koduri; Sreenivasan K. | 2019-04-11 |
Industrial Chip Scale Package For Microelectronic Device
App 20190109093 - Koduri; Sreenivasan K | 2019-04-11 |
Shaped Interconnect Bumps in Semiconductor Devices
App 20190109110 - Koduri; Sreenivasan K. | 2019-04-11 |
Pre-Molded Leadframes in Semiconductor Devices
App 20190109076 - Koduri; Sreenivasan K. | 2019-04-11 |
Thermoelectric Device Embedded In A Printed Circuit Board
App 20180323361 - Edwards; Henry L. ; et al. | 2018-11-08 |
Integration Of A Passive Component In A Cavity Of An Integrated Circuit Package
App 20180301402 - MORRONI; Jeffrey ; et al. | 2018-10-18 |
Integration Of A Passive Component In An Integrated Circuit Package
App 20180301404 - MORRONI; Jeffrey ; et al. | 2018-10-18 |
Integration Of A Passive Component In A Cavity Of An Integrated Circuit Package
App 20180301403 - MORRONI; Jeffrey ; et al. | 2018-10-18 |
Discrete device mounted on substrate
Grant 9,899,339 - Romig , et al. February 20, 2 | 2018-02-20 |
Thermometer Device And Method Of Making
App 20170227403 - Koduri; Sreenivasan K. | 2017-08-10 |
Thermometer device and method of making
Grant 9,664,574 - Koduri May 30, 2 | 2017-05-30 |
X-ray sensor and signal processing assembly for an X-ray computed tomography machine
Grant 9,354,186 - Bartolome , et al. May 31, 2 | 2016-05-31 |
Method for embedding controlled-cavity MEMS package in integration board
Grant 9,321,631 - Manack , et al. April 26, 2 | 2016-04-26 |
High pin count, small packages having heat-dissipating pad
Grant 9,305,871 - Koduri April 5, 2 | 2016-04-05 |
Cantilevered Leadframe Support Structure for Magnetic Wireless Transfer Between Integrated Circuit Dies
App 20150325501 - Sutton; Benjamin Michael ; et al. | 2015-11-12 |
Integrated circuit package with printed circuit layer
Grant 9,111,845 - Romig , et al. August 18, 2 | 2015-08-18 |
High Pin Count, Small Packages Having Heat-dissipating Pad
App 20150228566 - KODURI; Sreenivasan K. | 2015-08-13 |
High pin count, small SON/QFN packages
Grant 9,013,032 - Koduri April 21, 2 | 2015-04-21 |
Thermometer Device And Method Of Making
App 20150036719 - Koduri; Sreenivasan K | 2015-02-05 |
Electronic assembly with three dimensional inkjet printed traces
Grant 8,945,986 - Romig , et al. February 3, 2 | 2015-02-03 |
Method For Embedding Controlled-cavity Mems Package In Integration Board
App 20150004739 - Manack; Christopher Daniel ; et al. | 2015-01-01 |
Integrated Circuit Package With Printed Circuit Layer
App 20140361402 - Romig; Matthew David ; et al. | 2014-12-11 |
High Pin Count, Small Son/qfn Packages
App 20140345915 - KODURI; Sreenivasan K. | 2014-11-27 |
Active Shield For X-ray Computed Tomography Machine
App 20140321601 - Koduri; Sreenivasan K. | 2014-10-30 |
Methods for embedding controlled-cavity MEMS package in integration board
Grant 8,866,237 - Manack , et al. October 21, 2 | 2014-10-21 |
X-ray Sensor And Signal Processing Assembly For An X-ray Computed Tomography Machine
App 20140270057 - Bartolome; Eduardo ; et al. | 2014-09-18 |
High pin count, small SON/QFN packages having heat-dissipating pad
Grant 8,836,107 - Koduri September 16, 2 | 2014-09-16 |
Electronic assembly with three dimensional inkjet printed traces
Grant 8,816,513 - Romig , et al. August 26, 2 | 2014-08-26 |
Integrated Circuit Package With Printed Circuit Layer
App 20140175599 - Romig; Matthew David ; et al. | 2014-06-26 |
Discrete Device Mounted On Substrate
App 20140124939 - Romig; Matthew David ; et al. | 2014-05-08 |
Electronic Assembly with Three Dimensional Inkjet Printed Traces
App 20140127856 - Romig; Matthew David ; et al. | 2014-05-08 |
Method for semiconductor leadframes in low volume and rapid turnaround
Grant 8,669,647 - Koduri March 11, 2 | 2014-03-11 |
Electronic Assembly With Three Dimensional Inkjet Printed Traces
App 20140054795 - Romig; Matthew David ; et al. | 2014-02-27 |
Method for semiconductor leadframes in low volume and rapid turnaround
Grant 8,624,363 - Koduri January 7, 2 | 2014-01-07 |
Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame
Grant 8,569,082 - Kummerl , et al. October 29, 2 | 2013-10-29 |
Methods for Embedding Controlled-Cavity MEMS Package in Integration Board
App 20130221455 - Manack; Christopher D. ; et al. | 2013-08-29 |
Thermoelectric Device Embedded In A Printed Circuit Board
App 20130192655 - Edwards; Henry L. ; et al. | 2013-08-01 |
Structure And Method For Power Field Effect Transistor
App 20130034936 - Koduri; Sreenivasan K. | 2013-02-07 |
Structure and method for power field effect transistor
Grant 8,361,839 - Koduri January 29, 2 | 2013-01-29 |
Structure and method for power field effect transistor
Grant 8,358,014 - Koduri January 22, 2 | 2013-01-22 |
Multi-component electronic system having leadframe with support-free with cantilever leads
Grant 8,304,868 - Amaro , et al. November 6, 2 | 2012-11-06 |
High Pin Count, Small Son/qfn Packages Having Heat-dissipating Pad
App 20120217044 - KODURI; Sreenivasan K. | 2012-08-30 |
Method For Semiconductor Leadframes In Low Volume And Rapid Turnaround
App 20120126385 - KODURI; Sreenivasan K. | 2012-05-24 |
Method For Semiconductor Leadframes In Low Volume And Rapid Turnaround
App 20120126383 - KODURI; Sreenivasan K. | 2012-05-24 |
Multi-Component Electronic System Having Leadframe with Support-Free Cantilever Leads
App 20120086112 - Amaro; Michael G. ; et al. | 2012-04-12 |
Method for semiconductor leadframes in low volume and rapid turnaround
Grant 8,133,763 - Koduri March 13, 2 | 2012-03-13 |
Manufacturing method for integrating a shunt resistor into a semiconductor package
Grant 8,129,228 - Udompanyavit , et al. March 6, 2 | 2012-03-06 |
Semiconductor Package with a Mold Material Encapsulating a Chip and a Portion of a Lead Frame
App 20120015479 - KUMMERL; Steven A. ; et al. | 2012-01-19 |
Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame
Grant 8,072,770 - Kummerl , et al. December 6, 2 | 2011-12-06 |
Ball-Grid Array Device Having Chip Assembled on Half-Etched metal Leadframe
App 20110248392 - Javier; Reynaldo C. ; et al. | 2011-10-13 |
Power semiconductor devices having integrated inductor
Grant 8,017,410 - Koduri September 13, 2 | 2011-09-13 |
Bumpless wafer scale device and board assembly
Grant 7,910,471 - Zuniga-Ortiz , et al. March 22, 2 | 2011-03-22 |
Manufacturing Method for Integrating a Shunt Resistor into a Semiconductor Package
App 20110033985 - Udompanyavit; Ubol ; et al. | 2011-02-10 |
Semiconductor Package Thermal Performance Enhancement and Method
App 20110024895 - Koduri; Sreenivasan K. ; et al. | 2011-02-03 |
Manufacturing method for integrating a shunt resistor into a semiconductor package
Grant 7,847,391 - Udompanyavit , et al. December 7, 2 | 2010-12-07 |
Structure and Method for Power Field Effect Transistor
App 20100301496 - KODURI; Sreenivasan K. | 2010-12-02 |
Method for Semiconductor Leadframes in Low Volume and Rapid Turnaround
App 20100295161 - KODURI; Sreenivasan K. | 2010-11-25 |
Power Semiconductor Devices Having Integrated Inductor
App 20100197045 - KODURI; Sreenivasan K. | 2010-08-05 |
Power semiconductor devices having integrated inductor
Grant 7,723,129 - Koduri May 25, 2 | 2010-05-25 |
Semiconductor Package
App 20100091472 - KUMMERL; Steven A. ; et al. | 2010-04-15 |
Manufacturing Method For Integrating A Shunt Resistor Into A Semiconductor Package
App 20100001382 - Udompanyavit; Ubol ; et al. | 2010-01-07 |
Power Semiconductor Devices Having Integrated Inductor
App 20090186453 - KODURI; Sreenivasan K. | 2009-07-23 |
Power semiconductor devices having integrated inductor
Grant 7,531,893 - Koduri May 12, 2 | 2009-05-12 |
Semiconductor Package Thermal Performance Enhancement and Method
App 20090115053 - Koduri; Sreenivasan K. ; et al. | 2009-05-07 |
Multidirectional Semiconductor Device Package Thermal Enhancement Systems and Methods
App 20090045503 - Koduri; Sreenivasan K. | 2009-02-19 |
Power Semiconductor Devices Having Integrated Inductor
App 20080029907 - Koduri; Sreenivasan K. | 2008-02-07 |
Semiconductor Package Having Improved Adhesion and Solderability
App 20080012101 - Zuniga-Ortiz; Edgar R. ; et al. | 2008-01-17 |
Process and system to package residual quantities of wafer level packages
Grant 7,189,938 - Koduri , et al. March 13, 2 | 2007-03-13 |
System and method for enhancing wafer chip scale packages
App 20060237828 - Robinson; William Dale ; et al. | 2006-10-26 |
System And Method To Customize Bond Programs Compensating Integrated Circuit Bonder Variability
App 20060217817 - Bon; David J. ; et al. | 2006-09-28 |
Method for efficient annealing of plated semiconductor package leads
App 20060189029 - Koduri; Sreenivasan K. ; et al. | 2006-08-24 |
System and method to customize bond programs compensating integrated circuit bonder variability
Grant 7,069,102 - Bon , et al. June 27, 2 | 2006-06-27 |
Semiconductor package having improved adhesion and solderability
App 20060125062 - Zuniga-Ortiz; Edgar R. ; et al. | 2006-06-15 |
Reduced foot print lead-less package with tolerance for thermal and mechanical stresses and method thereof
App 20060049492 - Holloway; Jeffrey Gail ; et al. | 2006-03-09 |
Flip-chip without bumps and polymer for board assembly
App 20060006532 - Zuniga-Ortiz; Edgar R. ; et al. | 2006-01-12 |
Plastic encapsulated semiconductor device with reliable down bonds
App 20060006510 - Koduri; Sreenivasan K. | 2006-01-12 |
Method of inkless wafer blind assembly
Grant 6,927,081 - Subramanian , et al. August 9, 2 | 2005-08-09 |
Bumpless wafer scale device and board assembly
App 20050167826 - Zuniga-Ortiz, Edgar R. ; et al. | 2005-08-04 |
Flip-chip without bumps and polymer for board assembly
Grant 6,914,332 - Zuniga-Ortiz , et al. July 5, 2 | 2005-07-05 |
Process and system to package residual quantities of wafer level packages
App 20050121372 - Koduri, Sreenivasan K. ; et al. | 2005-06-09 |
Process and system to package residual quantities of wafer level packages
Grant 6,861,608 - Koduri , et al. March 1, 2 | 2005-03-01 |
Method of inkless wafer blind assembly
App 20040215417 - Subramanian, Balamurugan ; et al. | 2004-10-28 |
Method of controlling bond process quality by measuring wire bond features
Grant 6,789,240 - Koduri September 7, 2 | 2004-09-07 |
Bumpless wafer scale device and board assembly
Grant 6,768,210 - Zuniga-Ortiz , et al. July 27, 2 | 2004-07-27 |
Back side coating of semiconductor wafers
Grant 6,734,532 - Koduri , et al. May 11, 2 | 2004-05-11 |
Process and system to package residual quantities of wafer level packages
App 20030224557 - Koduri, Sreenivasan K. ; et al. | 2003-12-04 |
System and method to reduce bond program errors of integrated circuit bonders
Grant 6,629,013 - Koduri , et al. September 30, 2 | 2003-09-30 |
Flip-chip without bumps and polymer for board assembly
App 20030141593 - Zuniga-Ortiz, Edgar R. ; et al. | 2003-07-31 |
System and method to recreate illumination conditions on integrated circuit bonders
Grant 6,597,963 - Koduri , et al. July 22, 2 | 2003-07-22 |
Back side coating of semiconductor wafers
App 20030109082 - Koduri, Sreenivasan K. ; et al. | 2003-06-12 |
Method of controlling bond process quality by measuring wire bond features
App 20030098707 - Koduri, Sreenivasan K. | 2003-05-29 |
Bumpless wafer scale device and board assembly
App 20030080392 - Zuniga-Ortiz, Edgar R. ; et al. | 2003-05-01 |
Method of controlling bond process quality by measuring wire bond features
App 20020028524 - Koduri, Sreenivasan K. | 2002-03-07 |
Method of self-correcting bond placement errors of integrated circuit bonders
App 20020014515 - Koduri, Sreenivasan K. | 2002-02-07 |
System and method to recreate illumination conditions on integrated circuit bonders
App 20010047366 - Koduri, Sreenivasan K. ; et al. | 2001-11-29 |
System and method to customize bond programs compensating integrated circuit bonder variability
App 20010044660 - Bon, David J. ; et al. | 2001-11-22 |
System and method to reduce bond program errors of integrated circuit bonders
App 20010044669 - Koduri, Sreenivasan K. ; et al. | 2001-11-22 |
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