KODAMA; Munehisa

Patent Applications and Registrations

Patent applications and USPTO patent grants for KODAMA; Munehisa.The latest application filed is for "substrate processing apparatus, substrate processing system and substrate processing method".

Company Profile

7.2.11

KODAMA; Munehisa - Kikuchi-gun Kumamoto
KODAMA; Munehisa - Koshi-shi Kumamoto
Kodama; Munehisa - Koshi JP
KODAMA; Munehisa - Koshi City Kumamoto

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate Processing Apparatus, Substrate Processing System And Substrate Processing Method App 20220277962 - KODAMA; Munehisa ; et al.	2022-09-01
Substrate Processing Apparatus And Substrate Processing Method App 20220234160 - YAMAWAKI; Yohei ; et al.	2022-07-28
Substrate Processing Apparatus And Substrate Processing Method App 20210391177 - KAWAGUCHI; Yoshihiro ; et al.	2021-12-16
Substrate Processing System And Substrate Processing Method App 20210327738 - KODAMA; Munehisa	2021-10-21
Substrate transfer device, substrate processing system, substrate processing method and computer-readable recording medium Grant 11,120,985 - Kodama September 14, 2	2021-09-14
Substrate Processing System, Substrate Processing Method And Computer-readable Recording Medium App 20210050241 - KODAMA; Munehisa	2021-02-18
Substrate processing apparatus and manufacturing method of substrate holding unit Grant 10,833,045 - Otsuka , et al. November 10, 2	2020-11-10
Substrate Transfer Device, Substrate Processing System, Substrate Processing Method And Computer-readable Recording Medium App 20200306925 - KODAMA; Munehisa	2020-10-01
Substrate Processing Method App 20200234961 - TAMURA; Takeshi ; et al.	2020-07-23
Substrate Processing System, Substrate Processing Method And Computer-readable Recording Medium App 20200139503 - KODAMA; Munehisa ; et al.	2020-05-07
Grinding Apparatus, Grinding Method And Computer-readable Recording Medium App 20200130124 - TAMURA; Takeshi ; et al.	2020-04-30
Bonding Apparatus And Bonding Method App 20200020553 - Otsuka; Yoshitaka ; et al.	2020-01-16
Substrate Processing Apparatus And Manufacturing Method Of Substrate Holding Unit App 20180342479 - Otsuka; Yoshitaka ; et al.	2018-11-29

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