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name:-0.0084059238433838
name:-0.007537841796875
name:-0.00049400329589844
Kodama; Hironori Patent Filings

Kodama; Hironori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kodama; Hironori.The latest application filed is for "semiconductor device structural body and electronic device".

Company Profile
0.7.5
  • Kodama; Hironori - Chiyoda-ku JP
  • Kodama, Hironori - Mito JP
  • Kodama; Hironori - Hitachi JP
  • Kodama, Hironori - Hitachi-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multi-phase alternating-current rotational electric machine
Grant 7,075,201 - Takahashi , et al. July 11, 2
2006-07-11
Semiconductor device structural body and electronic device
App 20050029666 - Kurihara, Yasutoshi ;   et al.
2005-02-10
Multi-phase alternating-current rotational electric machine
App 20040183385 - Takahashi, Yoshimasa ;   et al.
2004-09-23
Semiconductor device, including an arrangement to provide a uniform press contact and converter using same
Grant 6,686,658 - Kodama , et al. February 3, 2
2004-02-03
Semiconductor device, including an arrangementto provide a uniform press contact and converter using same
App 20030001258 - Kodama, Hironori ;   et al.
2003-01-02
Semiconductor device, including an arrangement to provide a uniform press contact and converter using same
Grant 6,495,924 - Kodama , et al. December 17, 2
2002-12-17
Flat semiconductor device and power converter employing the same
App 20020145188 - Kodama, Hironori ;   et al.
2002-10-10
Press Contact Type Semiconductor Device And Converter Using Same
App 20020005578 - KODAMA, HIRONORI ;   et al.
2002-01-17
Method for producing multilayer ceramic body with convex side faces
Grant 5,277,723 - Kodama , et al. January 11, 1
1994-01-11
Installation structure of integrated circuit devices
Grant 5,045,922 - Kodama , et al. September 3, 1
1991-09-03
Integrated circuit package having heat sink bonded with resinous adhesive
Grant 4,965,660 - Ogihara , et al. October 23, 1
1990-10-23
High toughness ceramics and process for the preparation thereof
Grant 4,729,972 - Kodama , et al. March 8, 1
1988-03-08

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