Kodaira; Tadashi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kodaira; Tadashi.The latest application filed is for "semiconductor device".
- Kodaira; Tadashi - Nagano JP
- Kodaira; Tadashi - Nagano-shi JP
| Patent | Date |
|---|---|
| Wiring substrate Grant 10,290,570 - Arai , et al. | 2019-05-14 |
| Semiconductor device Grant 10,121,695 - Arai , et al. November 6, 2 | 2018-11-06 |
| Semiconductor Device App 20180218941 - ARAI; Tadashi ; et al. | 2018-08-02 |
| Wiring Substrate App 20180218972 - ARAI; Tadashi ; et al. | 2018-08-02 |
| Optoelectric composite substrate and method of manufacturing the same Grant 7,873,245 - Yonekura , et al. January 18, 2 | 2011-01-18 |
| Solder bump forming method Grant 7,807,560 - Imafuji , et al. October 5, 2 | 2010-10-05 |
| Optoelectric composite substrate and method of manufacturing the same Grant 7,801,396 - Yonekura , et al. September 21, 2 | 2010-09-21 |
| Package for semiconductor devices App 20100155114 - Ooi; Kazuhiko ; et al. | 2010-06-24 |
| Package for semiconductor devices App 20100155933 - Ooi; Kazuhiko ; et al. | 2010-06-24 |
| Package for semiconductor devices Grant 7,696,617 - Ooi , et al. April 13, 2 | 2010-04-13 |
| Wiring Substrate And Method Of Manufacturing The Same App 20090288870 - KONDO; Hitoshi ; et al. | 2009-11-26 |
| Solder Bump Forming Method App 20090023281 - Imafuji; Kei ; et al. | 2009-01-22 |
| Optoelectric composite substrate and method of manufacturing the same App 20080251496 - Yonekura; Hideki ; et al. | 2008-10-16 |
| Optoelectric composite substrate and method of manufacturing the same App 20080107375 - Yonekura; Hideki ; et al. | 2008-05-08 |
| Optoelectric composite substrate and method of manufacturing the same Grant 7,340,121 - Yonekura , et al. March 4, 2 | 2008-03-04 |
| Package for semiconductor devices App 20080042258 - Ooi; Kazuhiko ; et al. | 2008-02-21 |
| Package for semiconductor devices Grant 7,285,856 - Ooi , et al. October 23, 2 | 2007-10-23 |
| Multilayered substrate for semiconductor device Grant 7,196,426 - Nakamura , et al. March 27, 2 | 2007-03-27 |
| Multilayered substrate for semiconductor device Grant 7,164,198 - Nakamura , et al. January 16, 2 | 2007-01-16 |
| Method for producing wiring substrate Grant 7,093,356 - Imafuji , et al. August 22, 2 | 2006-08-22 |
| Method for producing multilayer circuit board for semiconductor device Grant 6,988,312 - Nakamura , et al. January 24, 2 | 2006-01-24 |
| Optoelectric composite substrate and method of manufacturing the same App 20050190808 - Yonekura, Hideki ; et al. | 2005-09-01 |
| Multilayered substrate for semiconductor device App 20050087860 - Nakamura, Jyunichi ; et al. | 2005-04-28 |
| Package for semiconductor devices App 20050006744 - Ooi, Kazuhiko ; et al. | 2005-01-13 |
| Multilayered substrate for semiconductor device Grant 6,759,739 - Nakamura , et al. July 6, 2 | 2004-07-06 |
| Method for manufacturing multilayer circuit board for semiconductor device App 20040074088 - Nakamura, Jyunichi ; et al. | 2004-04-22 |
| Method for producing wiring substrate App 20040060174 - Imafuji, Kei ; et al. | 2004-04-01 |
| Multilayered substrate for semiconductor device App 20040046244 - Nakamura, Jyunichi ; et al. | 2004-03-11 |
| Multilayered substrate for semiconductor device App 20030080409 - Nakamura, Jyunichi ; et al. | 2003-05-01 |
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