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Patent applications and USPTO patent grants for Kocian; Thomas Allan.The latest application filed is for "wafer level mems package including dual seal ring".
Patent | Date |
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Wafer level MEMS package including dual seal ring Grant 9,969,610 - Diep , et al. May 15, 2 | 2018-05-15 |
Wafer level MEMS package including dual seal ring Grant 9,771,258 - Diep , et al. September 26, 2 | 2017-09-26 |
Hermetically sealed package having stress reducing layer Grant 9,708,181 - Kennedy , et al. July 18, 2 | 2017-07-18 |
Wafer Level Mems Package Including Dual Seal Ring App 20170129775 - Diep; Buu Q. ;   et al. | 2017-05-11 |
Wafer Level Mems Package Including Dual Seal Ring App 20160376146 - Diep; Buu Q. ;   et al. | 2016-12-29 |
Hermetically Sealed Package Having Stress Reducing Layer App 20160167959 - Kennedy; Adam M. ;   et al. | 2016-06-16 |
Hermetically sealed package having stress reducing layer Grant 9,334,154 - Kennedy , et al. May 10, 2 | 2016-05-10 |
Getter Structure And Method For Forming Such Structure App 20160040282 - Gooch; Roland ;   et al. | 2016-02-11 |
Hermetically Sealed Package Having Stress Reducing Layer App 20160039665 - Kennedy; Adam M. ;   et al. | 2016-02-11 |
Getter structure and method for forming such structure Grant 9,196,556 - Gooch , et al. November 24, 2 | 2015-11-24 |
Integrated bondline spacers for wafer level packaged circuit devices Grant 9,187,312 - Gooch , et al. November 17, 2 | 2015-11-17 |
Integrated bondline spacers for wafer level packaged circuit devices Grant 9,174,836 - Gooch , et al. November 3, 2 | 2015-11-03 |
Getter Structure And Method For Forming Such Structure App 20150249042 - Gooch; Roland ;   et al. | 2015-09-03 |
Method of forming deposited patterns on a surface Grant 9,105,800 - Gooch , et al. August 11, 2 | 2015-08-11 |
Wafer level package solder barrier used as vacuum getter Grant 9,093,444 - Gooch , et al. July 28, 2 | 2015-07-28 |
Method Of Forming Deposited Patterns On A Surface App 20150162479 - Gooch; Roland ;   et al. | 2015-06-11 |
Wafer Level Package Solder Barrier Used As Vacuum Getter App 20150014854 - Gooch; Roland W. ;   et al. | 2015-01-15 |
Integrated Bondline Spacers For Wafer Level Packaged Circuit Devices App 20140346643 - Gooch; Roland ;   et al. | 2014-11-27 |
Integrated Bondline Spacers For Wafer Level Packaged Circuit Devices App 20140193948 - Gooch; Roland ;   et al. | 2014-07-10 |
Getter Structure For Wafer Level Vacuum Packaged Device App 20140175590 - Gooch; Roland ;   et al. | 2014-06-26 |
Integrated bondline spacers for wafer level packaged circuit devices Grant 8,736,045 - Gooch , et al. May 27, 2 | 2014-05-27 |
Integrated Bondline Spacers For Wafer Level Packaged Circuit Devices App 20140124899 - Gooch; Roland ;   et al. | 2014-05-08 |
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