Kochilla; John R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kochilla; John R..The latest application filed is for "chromium-free passivation of vapor deposited aluminum surfaces".

Company Profile

0.7.7

Kochilla; John R. - Rock Hill SC
Kochilla; John R. - Cleveland OH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chromium-free Passivation Of Vapor Deposited Aluminum Surfaces App 20110206844 - Wiles; Jacob Grant ; et al.	2011-08-25
Metal Pieces And Articles Having Improved Corrosion Resistance App 20060286399 - Kochilla; John R. ; et al.	2006-12-21
Metal pieces and articles having improved corrosion resistance Grant 7,101,469 - Kochilla , et al. September 5, 2	2006-09-05
Metal pieces and articles having improved corrosion resistance App 20060099439 - Kochilla; John R. ; et al.	2006-05-11
Apparatus and method for treatment of metal surfaces by inorganic electrophoretic passivation App 20050121332 - Kochilla, John R. ; et al.	2005-06-09
Tin whisker-free printed circuit board Grant 6,720,499 - Bokisa , et al. April 13, 2	2004-04-13
Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom Grant 6,602,440 - Bishop , et al. August 5, 2	2003-08-05
Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom Grant 6,579,591 - Bishop , et al. June 17, 2	2003-06-17
Tin whisker-free printed circuit board App 20020064676 - Bokisa, George S. ; et al.	2002-05-30
Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom App 20020056702 - Bishop, Craig V. ; et al.	2002-05-16
Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom App 20020048685 - Bishop, Craig V. ; et al.	2002-04-25
Process for whisker-free aqueous electroless tin plating Grant 6,361,823 - Bokisa , et al. March 26, 2	2002-03-26
Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom Grant 6,284,309 - Bishop , et al. September 4, 2	2001-09-04
Copper etching compositions and method for etching copper Grant 6,086,779 - Bishop , et al. July 11, 2	2000-07-11

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