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Patent applications and USPTO patent grants for KOCH; Roland.The latest application filed is for "apparatus for especially thermally joining micro-electromechanical parts".
Patent | Date |
---|---|
Apparatus For Especially Thermally Joining Micro-electromechanical Parts App 20170243851 - RANGELOV; Ventzeslav ;   et al. | 2017-08-24 |
Diaphragm vacuum pump Grant 8,790,094 - Felber , et al. July 29, 2 | 2014-07-29 |
Diaphragm Vacuum Pump App 20120070323 - Felber; Armin ;   et al. | 2012-03-22 |
Apparatus for distributing small objects in a fill station Grant 7,389,632 - Seiffert , et al. June 24, 2 | 2008-06-24 |
Apparatus for distributing small objects in a fill station App 20080006007 - Seiffert; Martin ;   et al. | 2008-01-10 |
Measuring device, and method for locating a partial discharge Grant 7,285,960 - Koch , et al. October 23, 2 | 2007-10-23 |
Measuring device, and method for locating a partial discharge App 20070057677 - Koch; Roland ;   et al. | 2007-03-15 |
Device for internal welding of pipes or the like Grant 4,500,764 - Girodi , et al. February 19, 1 | 1985-02-19 |
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