Kobayashi; Syuichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kobayashi; Syuichi.The latest application filed is for "method for double-side polishing wafer".

Company Profile

1.15.12

Kobayashi; Syuichi - Shirakawa JP
KOBAYASHI; Syuichi - Shirakawa-shi JP
Kobayashi; Syuichi - Nishishirakawa JP
Kobayashi; Syuichi - Nishigo-mura N/A JP
Kobayashi; Syuichi - Fukushima JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for double-side polishing wafer Grant 11,298,796 - Tanaka , et al. April 12, 2	2022-04-12
Method for evaluating polishing pad and method for polishing wafer Grant 10,118,272 - Tanaka , et al. November 6, 2	2018-11-06
Method For Double-side Polishing Wafer App 20180272497 - TANAKA; Yuki ; et al.	2018-09-27
Method of producing carrier for use in double-side polishing apparatus and method of double-side polishing wafers Grant 9,764,443 - Sato , et al. September 19, 2	2017-09-19
Manufacturing Method Of Carrier For Double-side Polishing Apparatus, Carrier For Double-side Polishing Apparatus, And Double-side Polishing Method App 20170069502 - SATO; Kazuya ; et al.	2017-03-09
Method For Evaluating Polishing Pad And Method For Polishing Wafer App 20160193711 - TANAKA; Yuki ; et al.	2016-07-07
Carrier for a double-side polishing apparatus, double-side polishing apparatus using this carrier, and double-side polishing method Grant 9,327,382 - Ueno , et al. May 3, 2	2016-05-03
Method of double-side polishing wafer Grant 9,266,215 - Sato , et al. February 23, 2	2016-02-23
Method Of Producing Carrier For Use In Double-side Polishing Apparatus And Method Of Double-side Polishing Wafers App 20150375363 - SATO; Kazuya ; et al.	2015-12-31
Method Of Double-side Polishing Wafer App 20150147942 - Sato; Kazuya ; et al.	2015-05-28
Double-side polishing apparatus Grant 8,834,234 - Ueno , et al. September 16, 2	2014-09-16
Polishing pad, manufacturing method thereof and polishing method Grant 8,545,291 - Itoyama , et al. October 1, 2	2013-10-01
Polishing apparatus Grant 8,454,410 - Kitagawa , et al. June 4, 2	2013-06-04
Double-side Polishing Apparatus App 20120329373 - Ueno; Junichi ; et al.	2012-12-27
Polishing Pad, Manufacturing Method Thereof And Polishing Method App 20120100783 - Itoyama; Kohki ; et al.	2012-04-26
Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing method Grant 8,118,646 - Sato , et al. February 21, 2	2012-02-21
Carrier For Double-side Polishing Apparatus, Double-side Polishing Apparatus Using The Same, And Double-side Polishing Method App 20110124271 - Sato; Kazuya ; et al.	2011-05-26
Carrier For A Double-side Polishing Apparatus, Double-side Polishing Apparatus Using This Carrier, And Double-side Polishing Method App 20110104995 - Ueno; Junichi ; et al.	2011-05-05
Polishing Apparatus App 20100144249 - Kitagawa; Koji ; et al.	2010-06-10
Double-side polishing method for wafer Grant 7,727,053 - Ueno , et al. June 1, 2	2010-06-01
Double-Side Polishing Method for Wafer App 20090124175 - Ueno; Junichi ; et al.	2009-05-14
Method for evaluating wafer configuration, wafer, and wafer sorting method Grant 6,975,960 - Kobayashi , et al. December 13, 2	2005-12-13
Wafer shape evaluating method, wafer, and wafer selecting method App 20040215418 - Kobayashi, Makoto ; et al.	2004-10-28

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