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Patent applications and USPTO patent grants for KOBAYASHI; Nobutoshi.The latest application filed is for "unsealing method of semiconductor device package and unsealing device of semiconductor device package".
Patent | Date |
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Unsealing Method Of Semiconductor Device Package And Unsealing Device Of Semiconductor Device Package App 20220023975 - OHTA; Naoto ;   et al. | 2022-01-27 |
Acrylic rubber, process for its production, and rubber compositions, oil-and weather-resistant rubber compositions, and oil-and weather -resistant rubbers, containing the same Grant 7,550,536 - Kobayashi , et al. June 23, 2 | 2009-06-23 |
Flame retardant rubber composition, rubber articles and wire covering materials App 20060111504 - Morioka; Seiji ;   et al. | 2006-05-25 |
Acrylic rubber, process for its production, and rubber compositions, oil-and weather-resistant rubber compositions, and oil-and weather -resistant rubbers, containing the same App 20050165191 - Kobayashi, Nobutoshi ;   et al. | 2005-07-28 |
Plastic mold decapsuling apparatus Grant 4,826,556 - Kobayashi May 2, 1 | 1989-05-02 |
Temperature controller system Grant 4,692,598 - Yoshida , et al. September 8, 1 | 1987-09-08 |
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