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Patent applications and USPTO patent grants for Kobayashi; Motoshige.The latest application filed is for "method for manufacturing semiconductor device".
Patent | Date |
---|---|
Method of manufacturing semiconductor chips Grant 8,148,240 - Kobayashi , et al. April 3, 2 | 2012-04-03 |
Method for manufacturing semiconductor device Grant 7,906,416 - Tsuchitani , et al. March 15, 2 | 2011-03-15 |
Method For Manufacturing Semiconductor Device App 20110053374 - Kobayashi; Motoshige | 2011-03-03 |
Wafer Including A Reinforcing Flange Formed Upright At A Periphery And Method For Manufacturing The Same App 20100207249 - SUGAWARA; Yasuharu ;   et al. | 2010-08-19 |
Semiconductor Device And Method For Manufacturing Same App 20100203688 - Kobayashi; Motoshige ;   et al. | 2010-08-12 |
Wafer including a reinforcing flange formed upright at a periphery and method for manufacturing the same Grant 7,737,531 - Sugawara , et al. June 15, 2 | 2010-06-15 |
Method Of Manufacturing Semiconductor Chips App 20100048000 - Kobayashi; Motoshige ;   et al. | 2010-02-25 |
Wafer And Method For Manufacturing Same App 20090102020 - SUGAWARA; Yasuharu ;   et al. | 2009-04-23 |
Semiconductor device and method of manufacturing the same Grant 7,488,993 - Tokano , et al. February 10, 2 | 2009-02-10 |
Semiconductor Device And Method For Manufacturing Same App 20080296611 - Kobayashi; Motoshige ;   et al. | 2008-12-04 |
Method For Manufacturing Semiconductor Device App 20080299686 - KOBAYASHI; Motoshige ;   et al. | 2008-12-04 |
Method For Manufacturing Semiconductor Device App 20080090391 - TSUCHITANI; Masanobu ;   et al. | 2008-04-17 |
Semiconductor device and method of manufacturing the same App 20050208738 - Tokano, Kenichi ;   et al. | 2005-09-22 |
High breakdown voltage semiconductor device Grant 6,649,981 - Kobayashi , et al. November 18, 2 | 2003-11-18 |
Semiconductor device and method of manufacturing the same App 20020140035 - Kobayashi, Motoshige ;   et al. | 2002-10-03 |
Semiconductor device App 20020081784 - Kobayashi, Motoshige ;   et al. | 2002-06-27 |
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