Koay; Huck Khim
Patent Applications and Registrations
Patent applications and USPTO patent grants for Koay; Huck Khim.The latest application filed is for "encapsulating brittle substrates using transfer molding".
- Koay; Huck Khim - Penang MY
- Koay; Huck Khim - Georgetown Penang MY
| Patent | Date |
|---|---|
| Encapsulating brittle substrates using transfer molding Grant 7,114,939 - Tan , et al. October 3, 2 | 2006-10-03 |
| Light source Grant 6,806,583 - Koay , et al. October 19, 2 | 2004-10-19 |
| Encapsulating brittle substrates using transfer molding App 20030194459 - Tan, Cheng Why ; et al. | 2003-10-16 |
| Light Source App 20020047130 - Koay, Huck Khim ; et al. | 2002-04-25 |
| Method of interconnecting an electronic device Grant 6,242,280 - Koay , et al. June 5, 2 | 2001-06-05 |
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