KO; YOUN SUNG
Patent Applications and Registrations
Patent applications and USPTO patent grants for KO; YOUN SUNG.The latest application filed is for "system for laser bonding of flip chip".
- KO; YOUN SUNG - Chungcheongnam-do KR
- Ko; Youn-sung - Cheonnan-si KR
- Ko; Youn-sung - Cheonan-si KR
| Patent | Date |
|---|---|
| System For Laser Bonding Of Flip Chip App 20220052019 - KO; YOUN SUNG ; et al. | 2022-02-17 |
| Flip-chip Bonding Apparatus Using Vcsel Device App 20210335748 - Ko; Youn Sung ; et al. | 2021-10-28 |
| Apparatus for mounting conductive ball Grant 10,804,239 - Ko , et al. October 13, 2 | 2020-10-13 |
| Method of mounting conductive ball Grant 10,804,240 - Ko , et al. October 13, 2 | 2020-10-13 |
| Apparatus For Mounting Conductive Ball App 20200144219 - Ko; Youn Sung ; et al. | 2020-05-07 |
| Method Of Mounting Conductive Ball App 20200144220 - Ko; Youn Sung ; et al. | 2020-05-07 |
| Apparatus And Method For Detaching Chip App 20150279716 - KO; YOUN SUNG | 2015-10-01 |
| Method Of And Apparatus For Detaching Semiconductor Chips From A Tape App 20100037445 - Ko; Youn-sung ; et al. | 2010-02-18 |
| Die attaching apparatus Grant 7,650,687 - Woo , et al. January 26, 2 | 2010-01-26 |
| Apparatus for detaching a semiconductor chip from a tape Grant 7,624,498 - Ko , et al. December 1, 2 | 2009-12-01 |
| Wire bonding apparatus and method for clamping a wire Grant 7,481,351 - Kim , et al. January 27, 2 | 2009-01-27 |
| Dipping Detecting Device For Fabricating A Semiconductor Device App 20080090311 - ROH; Dong-joo ; et al. | 2008-04-17 |
| Method Of And Apparatus For Detaching Semiconductor Chips From A Tape App 20070293022 - KO; Youn-sung ; et al. | 2007-12-20 |
| System And Method For Sensing Shape Of Chip App 20070277128 - HAN; Dong-Chul ; et al. | 2007-11-29 |
| Multi-chip die bonder and method App 20060266792 - Ko; Youn-Sung ; et al. | 2006-11-30 |
| Die attaching apparatus, and system and method for cleaning the same App 20060048381 - Woo; Jung-Hwan ; et al. | 2006-03-09 |
| Wire bonding apparatus and method for clamping a wire App 20050133563 - Kim, Tae-Hyun ; et al. | 2005-06-23 |
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