Ko; WonJun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ko; WonJun.The latest application filed is for "semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage".

Company Profile

2.27.18

Ko; WonJun - Kyungki-Do KR
Ko; WonJun - Sungnam-Si N/A KP
- Sungnam-si KR
Ko; WonJun - Ichon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure Grant 10,163,744 - Kim , et al. Dec	2018-12-25
Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage Grant 9,279,673 - Ko , et al. March 8, 2	2016-03-08
Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias Grant 9,252,032 - Choi , et al. February 2, 2	2016-02-02
Dual-sided film-assist molding process Grant 9,076,802 - Ko , et al. July 7, 2	2015-07-07
Semiconductor Device and Method of Calibrating Warpage Testing System to Accurately Measure Semiconductor Package Warpage App 20140269810 - Ko; WonJun ; et al.	2014-09-18
Integrated circuit package system with wafer scale heat slug Grant 08618653 -	2013-12-31
Integrated circuit package system with wafer scale heat slug Grant 8,618,653 - Ko , et al. December 31, 2	2013-12-31
Integrated circuit package system employing multi-package module techniques Grant 8,609,463 - Ko , et al. December 17, 2	2013-12-17
Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof Grant 8,569,882 - Ko , et al. October 29, 2	2013-10-29
Semiconductor Device and Method of Forming Protective Coating Material Over Semiconductor Wafer to Reduce Lamination Tape Residue App 20130256840 - Yun; JaEun ; et al.	2013-10-03
Integrated circuit packaging system with dielectric support and method of manufacture thereof Grant 8,546,957 - Ko , et al. October 1, 2	2013-10-01
Integrated circuit packaging system with trenches and method of manufacture thereof Grant 8,536,718 - Ko , et al. September 17, 2	2013-09-17
Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue Grant 8,524,537 - Yun , et al. September 3, 2	2013-09-03
Integrated circuit packaging system with heat spreader and method of manufacture thereof Grant 8,415,204 - Yun , et al. April 9, 2	2013-04-09
Semiconductor Device and Method of Forming a Low Profile Dual-Purpose Shield and Heat-Dissipation Structure App 20130056862 - Kim; OhHan ; et al.	2013-03-07
Semiconductor Device and Method of Stacking Semiconductor Die in Mold Laser Package Interconnected By Bumps and Conductive Vias App 20120299174 - Choi; DaeSik ; et al.	2012-11-29
Integrated Circuit Packaging System With Collapsed Multi-integration Package And Method Of Manufacture Thereof App 20120241980 - Ko; WonJun ; et al.	2012-09-27
Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias Grant 8,263,435 - Choi , et al. September 11, 2	2012-09-11
Integrated circuit packaging system with interposer Grant 8,227,925 - Song , et al. July 24, 2	2012-07-24
Integrated Circuit Packaging System With Interposer App 20120146243 - Song; Sungmin ; et al.	2012-06-14
Integrated Circuit Packaging System With Dielectric Support And Method Of Manufacture Thereof App 20120146246 - Ko; WonJun ; et al.	2012-06-14
Semiconductor Device and Method of Stacking Semiconductor Die in Mold Laser Package Interconnected by Bumps and Conductive Vias App 20120104624 - Choi; DaeSik ; et al.	2012-05-03
Integrated circuit packaging system with interposer Grant 8,124,451 - Song , et al. February 28, 2	2012-02-28
Integrated Circuit Packaging System With Trenches And Method Of Manufacture Thereof App 20110316162 - Ko; WonJun ; et al.	2011-12-29
Integrated circuit package system with package integration Grant 8,067,275 - Ko , et al. November 29, 2	2011-11-29
Semiconductor Device and Method of Forming Protective Coating Material Over Semiconductor Wafer to Reduce Lamination Tape Residue App 20110266656 - Yun; JaEun ; et al.	2011-11-03
Integrated circuit package system with support structure under wire-in-film adhesive Grant 8,035,211 - Ko , et al. October 11, 2	2011-10-11
Base package system for integrated circuit package stacking and method of manufacture thereof Grant 8,022,538 - Ko , et al. September 20, 2	2011-09-20
Integrated Circuit Packaging System With Heat Spreader And Method Of Manufacture Thereof App 20100244236 - Yun; JaEun ; et al.	2010-09-30
Base Package System For Integrated Circuit Package Stacking And Method Of Manufacture Thereof App 20100123247 - Ko; WonJun ; et al.	2010-05-20
Integrated Circuit Package System With Support Structure Under Wire-in-film Adhesive App 20090243070 - Ko; WonJun ; et al.	2009-10-01
Integrated Circuit Package System With Wafer Scale Heat Slug App 20090189275 - Ko; WonJun ; et al.	2009-07-30
Integrated Circuit Package System With Package Integration App 20090155961 - Ko; WonJun ; et al.	2009-06-18
Integrated Circuit Packaging System With Interposer App 20090079091 - Song; Sungmin ; et al.	2009-03-26
Integrated Circuit Package System Employing Multi-package Module Techniques App 20080227238 - Ko; WonJun ; et al.	2008-09-18

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