loadpatents
name:-0.0075230598449707
name:-0.0057330131530762
name:-0.0024998188018799
KO; Tae Ho Patent Filings

KO; Tae Ho

Patent Applications and Registrations

Patent applications and USPTO patent grants for KO; Tae Ho.The latest application filed is for "semiconductor package substrate and method of manufacturing semiconductor package using the same".

Company Profile
2.5.8
  • KO; Tae Ho - Suwon-si KR
  • KO; Tae Ho - Gyeonggi-do KR
  • Ko; Tae-Ho - Busan KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Package Substrate And Method Of Manufacturing Semiconductor Package Using The Same
App 20210375805 - KO; Tae Ho ;   et al.
2021-12-02
Semiconductor package substrate and method of manufacturing semiconductor package using the same
Grant 11,114,397 - Ko , et al. September 7, 2
2021-09-07
Semiconductor Package Substrate And Method Of Manufacturing Semiconductor Package Using The Same
App 20200312801 - KO; Tae Ho ;   et al.
2020-10-01
Fan-out semiconductor package
Grant 10,276,467 - Kim , et al.
2019-04-30
Fan-out semiconductor package
Grant 10,026,681 - Ko , et al. July 17, 2
2018-07-17
Waterproof Silicone Emulsion, Waterproof Board Exhibiting Excellent Crack Resistance, And Manufacturing Method Therefor
App 20180118940 - KANG; Kyoung Hoon ;   et al.
2018-05-03
Fan-out Semiconductor Package
App 20180082933 - KO; Tae Ho ;   et al.
2018-03-22
Fan-out Semiconductor Package
App 20170278766 - KIM; Eun Sil ;   et al.
2017-09-28
Flexible printed circuit board and manufacturing method thereof
Grant 9,674,969 - Lee , et al. June 6, 2
2017-06-06
Copper clad laminate, printed circuit board, and method of manufacturing the same
Grant 9,578,740 - Ko , et al. February 21, 2
2017-02-21
Flexible Printed Circuit Board And Manufacturing Method Thereof
App 20160183363 - LEE; Chang-Jae ;   et al.
2016-06-23
Rigid Flexible Pcb And Method For Manufacturing The Same
App 20150060114 - PARK; Jung Yong ;   et al.
2015-03-05
Copper Clad Laminate, Printed Circuit Board, And Method Of Manufacturing The Same
App 20150021084 - Ko; Tae Ho ;   et al.
2015-01-22

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